Fujifilm Xeon DP S26361-F3310-L280 Datenbogen
Produktcode
S26361-F3310-L280
74
Datasheet
6.1.2
Thermal Metrology
The maximum case temperatures (T
CASE
and
, and measured at
illustrates the
location where T
CASE
temperature measurements should be made. For detailed guidelines on
temperature measurement methodology, refer to the appropriate thermal/mechanical design guide.
NOTE: Figure is not to scale and is for reference only.
6.2
Processor Thermal Features
6.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the Thermal
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption as needed by modulating (starting and stopping) the
internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to
be operating within specifications. The temperature at which Thermal Monitor activates the
thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in
the normal manner, and interrupt requests are latched (and serviced during the time that the clocks
are on) while the TCC is active.
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption as needed by modulating (starting and stopping) the
internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to
be operating within specifications. The temperature at which Thermal Monitor activates the
thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in
the normal manner, and interrupt requests are latched (and serviced during the time that the clocks
are on) while the TCC is active.
When the Thermal Monitor is enabled, and a high temperature situation exists (i.e. TCC is active),
the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to
the processor (typically 30 -50%). Clocks will not be off for more than 3 microseconds when the
TCC is active. Cycle times are processor speed dependent and will decrease as processor core
frequencies increase. A small amount of hysteresis has been included to prevent rapid
active/inactive transitions of the TCC when the processor temperature is near its maximum
operating temperature. Once the temperature has dropped below the maximum operating
temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation
ceases.
the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to
the processor (typically 30 -50%). Clocks will not be off for more than 3 microseconds when the
TCC is active. Cycle times are processor speed dependent and will decrease as processor core
frequencies increase. A small amount of hysteresis has been included to prevent rapid
active/inactive transitions of the TCC when the processor temperature is near its maximum
operating temperature. Once the temperature has dropped below the maximum operating
temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation
ceases.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
Figure 13.
Case Temperature (T
CASE
) Measurement Location
Measure from edge of processor
Measure T
at this point.
CASE
21.25 mm
[0.837 in]
21.25 mm
[0.837 in]
42.5 mm FC-mPGA4 Package