Intel D201GLY Desktop Board BLKD201GLYLPAK10 Benutzerhandbuch
Produktcode
BLKD201GLYLPAK10
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING
TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Celeron, and Celeron Inside are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved. 0507/MS/VD
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING
TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Celeron, and Celeron Inside are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved. 0507/MS/VD
316977-001US
Technical Specifications
Processor
Processor Support
• Intel® Celeron® Processor integrated
Chipset
• SiS* SIS662 North Bridge
• SiS* SIS964L South Bridge
I/O Features
• Integrated super I/O LPC bus controller
• Ultra ATA 100/66 device support
• One PCI local bus slot
USB 2.0
• Two back-panel ports
• Two onboard headers providing four ports
support
Audio Solution
• AC’97-compliant integrated audio solution
10/100 Network Connection
• Onboard 10/100 Ethernet LAN
• Intel® Celeron® Processor integrated
Chipset
• SiS* SIS662 North Bridge
• SiS* SIS964L South Bridge
I/O Features
• Integrated super I/O LPC bus controller
• Ultra ATA 100/66 device support
• One PCI local bus slot
USB 2.0
• Two back-panel ports
• Two onboard headers providing four ports
support
Audio Solution
• AC’97-compliant integrated audio solution
10/100 Network Connection
• Onboard 10/100 Ethernet LAN
SPI
System BIOS
• 4 Mb Flash EEPROM with Intel® Tiano BIOS
featuring Plug and Play, IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0
Intel® Rapid BIOS Boot
• Optimized POST for fast access to PC
from power-on
• 4 Mb Flash EEPROM with Intel® Tiano BIOS
featuring Plug and Play, IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0
Intel® Rapid BIOS Boot
• Optimized POST for fast access to PC
from power-on
System Memory
Memory Capacity
• One 240-pin DIMM connector
• Designed to support up to 1 GB of system
memory using DDR2 533 / 400 SDRAM
Memory Type
• DDR2 533 / 400 SDRAM
Memory Voltage
• 1.8 V
Wake-up from Network
• Wired for Management (WfM) 2.0-compatible
• Support for system wake-up using an add-in
network interface card with remote wake-up
capability
Expansion Capabilities
• One PCI bus add-in card connector
• One 240-pin DIMM connector
• Designed to support up to 1 GB of system
memory using DDR2 533 / 400 SDRAM
Memory Type
• DDR2 533 / 400 SDRAM
Memory Voltage
• 1.8 V
Wake-up from Network
• Wired for Management (WfM) 2.0-compatible
• Support for system wake-up using an add-in
network interface card with remote wake-up
capability
Expansion Capabilities
• One PCI bus add-in card connector
Jumpers and Front-Panel Connectors
Jumpers
• Single configuration jumper design
• Jumper access for BIOS configuration mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off,
aux LED
• Two USB 2.0 headers
• Audio header
• Single configuration jumper design
• Jumper access for BIOS configuration mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off,
aux LED
• Two USB 2.0 headers
• Audio header
Mechanical
Board Style
• Mini-ITX, compatible with MicroATX board size
• 6.75” x 6.75” (17.145 cm x 17.145 cm)
Desktop Board Power Requirements
• ATX12V or SFX12V
• Mini-ITX, compatible with MicroATX board size
• 6.75” x 6.75” (17.145 cm x 17.145 cm)
Desktop Board Power Requirements
• ATX12V or SFX12V
Environment
Operating Temperature
• 0° C to +55° C
Storage Temperature
• -40° C to +70° C
Storage Temperature
• -40° C to +70° C
Regulations
Safety Regulations
United States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certified to EN 60950
International
Nemko certified to IEC 60950
(CB report with CB certificate)
EMC regulations (tested in
representative chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis
(cover off) testing
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B
International
CISPR 22:1997, Class B
United States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certified to EN 60950
International
Nemko certified to IEC 60950
(CB report with CB certificate)
EMC regulations (tested in
representative chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis
(cover off) testing
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B
International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF
via EN55022 +6 dB in system configurations with
an open chassis and EU Directive 89/336/EEC and
use via EN55022 and EN50082-1 in a represen-
tative chassis.
via EN55022 +6 dB in system configurations with
an open chassis and EU Directive 89/336/EEC and
use via EN55022 and EN50082-1 in a represen-
tative chassis.
Lead-Free: The symbol is used to
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in
identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in
any of the raw materials and the end product is
not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information, visit
developer.intel.com/design/motherbd/
Web site at www.intel.com. For the
most current product information, visit
developer.intel.com/design/motherbd/