Panasonic AQH3223 PCB Mount Relay (LED) 6V (LED) 10 - 20mA 1 NO, SPST-NO AQH3223 Datenbogen
Produktcode
AQH3223
AQ-H
4
ds_61613_en_aqh: 060207D
Cautions For Use of AQ-H
9. The following shows the packaging format
1) Tape and reel
1) Tape and reel
mm
inch
Type
Tape dimensions
Dimensions of paper tape reel
8-pin SMD type
1. The internal IC could be damaged if
a short forms between the I/O
terminals while the solid state relay is
powered.
2. If a steep rise voltage is applied
between output terminals-even if it is
below the repetitive peak OFF-state
voltage-output may enter the
conductive state regardless whether
or not input is present. Therefore,
please verify by using the actual
equipment.
3. Regardless of the input state, when
controlling loads of differing voltage
and current phases using the zero-
cross voltage type, the triac may not
turn on. Therefore, please verify by
using the actual equipment.
4. Output spike voltages
1) The figure below shows an ordinary
circuit. Please add a snubber circuit or
varistor, as noise/surge on the load side
could damage the unit or cause
malfunctions.
a short forms between the I/O
terminals while the solid state relay is
powered.
2. If a steep rise voltage is applied
between output terminals-even if it is
below the repetitive peak OFF-state
voltage-output may enter the
conductive state regardless whether
or not input is present. Therefore,
please verify by using the actual
equipment.
3. Regardless of the input state, when
controlling loads of differing voltage
and current phases using the zero-
cross voltage type, the triac may not
turn on. Therefore, please verify by
using the actual equipment.
4. Output spike voltages
1) The figure below shows an ordinary
circuit. Please add a snubber circuit or
varistor, as noise/surge on the load side
could damage the unit or cause
malfunctions.
Note) Connection of an external resister, etc.,
to terminal No. 5 (gate) is not necessary.
2) Even if spike voltages generated at the
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
5. Ripple in the input power supply
1) For LED operate current at E
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
5. Ripple in the input power supply
1) For LED operate current at E
min
,
maintain min. 10 mA
2) Keep the LED operate current at 50
mA or less at E
mA or less at E
max
.
6. Soldering
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260
°C
500
°F
.
2) When soldering surface-mount
terminals or SO package, the following
conditions are recommended.
(1) IR (Infrared reflow) soldering method
terminals or SO package, the following
conditions are recommended.
(1) IR (Infrared reflow) soldering method
(2) Soldering iron method
Tip temperature: 350 to 400
Tip temperature: 350 to 400
°C
Wattage: 30 to 60 W
Soldering time: within 3 s
(3) Others
Check mounting conditions before using
other soldering methods (DWS, VPS,
hot-air, hot plate, laser, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• When using lead-free solder we
recommend one with an alloy
composition of Sn3.0Ag0.5Cu. Please
Soldering time: within 3 s
(3) Others
Check mounting conditions before using
other soldering methods (DWS, VPS,
hot-air, hot plate, laser, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• When using lead-free solder we
recommend one with an alloy
composition of Sn3.0Ag0.5Cu. Please
consult us regarding details such as
soldering conditions.
7. Cleaning
The solid state relay forms an optical path
by coupling a light-emitting diode (LED)
and photodiode via transparent silicon
resin.
For this reason, unlike other directory
element molded resin products (e.g.,
MOS transistors and bipolar transistors),
avoid ultrasonic cleansing if at all
possible.
We recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output: No greater than 0.25
W/cm
soldering conditions.
7. Cleaning
The solid state relay forms an optical path
by coupling a light-emitting diode (LED)
and photodiode via transparent silicon
resin.
For this reason, unlike other directory
element molded resin products (e.g.,
MOS transistors and bipolar transistors),
avoid ultrasonic cleansing if at all
possible.
We recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output: No greater than 0.25
W/cm
2
• Cleaning time: No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Other: Submerge in solvent in order to
prevent the PCB and elements from
being contacted directly by the ultrasonic
vibrations.
• Cleanser used: Asahiklin AK-225
• Other: Submerge in solvent in order to
prevent the PCB and elements from
being contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
8. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45
1) Extreme vibration during transport will
warp the lead or damage the relay.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45
°C
32 to 113
°F
• Humidity: Less than 70% R.H.
• Atmosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
• Atmosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
1
8
4
3
2
5
6
Load
V
L
(AC)
E
min.
E
max.
T
1
T
2
T
3
T
1
= 150 to 180
°C
T
2
= 230
°C
T
3
= 250
°C
t
1
= 60 to 120 s or less
t
2
= 30 s or less
or less
482
°F
446
°F
302 to 356
°F
t
1
t
2
(1) When picked from 1/2/3/4-pin side: Part No. AQH❍❍❍AX (Shown above)
(2) When picked from 5/6/8-pin side: Part No. AQH❍❍❍AZ
1.5 dia.
+0.1
−0
0.3±0.05
Tractor feed holes
Device mounted
on tape
Direction of picking
1.55±0.1 dia.
4.5±0.3
2±0.1
10.1±0.1
4±0.1
1.75±0.1
10.2±0.1
12±0.1
7.5±0.1
16±0.3
.061±.004 dia.
.177±.012
.079±.004
.400±.004
.157±.004
.069±.004
.402±.004
.472±.004
.295±.004
.630±.012
.012±.002
.059 dia.
+.004
−0
21±0.8
80±1 dia.
13±0.5 dia.
17.5±2.0
2±0.5
2±0.5
80±1 dia.
300±2 dia.
.827±.031
3.150±.039 dia.
.512±.020 dia.
.689±.079
.079±.020
.079±.020
3.150±.039 dia.
11.811±.079 dia.
2) Tube
Devices are packaged in a tube so pin
No. 1 is on the stopper B side. Observe
correct orientation when mounting them
on PC boards.
Devices are packaged in a tube so pin
No. 1 is on the stopper B side. Observe
correct orientation when mounting them
on PC boards.
(DIP type)
StopperB
StopperA