Osram Components Phototransistors N/A SFH 325 FA Datenbogen

Produktcode
SFH 325 FA
Seite von 9
2007-04-04
8
SFH 325, SFH 325 FA
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
 
Soldering Conditions
Preconditioning acc. to JEDEC Level 2
 
Reflow Lötprofil für bleifreies Löten
(nach J-STD-020C)
 
Reflow Soldering Profile for lead free soldering
(acc. to J-STD-020C)
Wellenlöten (TTW)
(nach CECC 00802)
 
TTW Soldering
(acc. to CECC 00802)
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50
100
150
200
250
300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves