Fujitsu JS-12N-K PCB Mount Relay 12Vdc 1 CO, SPDT JS-12N-K Datenbogen

8

●

Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)

●

Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.

●

Most signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).

●

It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).

●

“LF” is marked on each outer and inner carton. (No marking on individual relays).

●

To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

We will ship leaded relays as long as the leaded relay inventory exists.

●

Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005)

●

Moisture Sensitivity Level standard is not applicable to electromechanical realys.

●

SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house

test.

●

Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating

is between the terminal and the Sn plating to avoid whisker.

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at
260˚C soler bath

Soldering Iron
Temperature:

maximum 360˚C

Duration:

maximum 3 sec.

max. 120 sec.

90~120 sec.

20~30 sec.

(duration)

Peak Temp.: max. 250˚C

250

220

130

170

temperature (˚C

)