Texas Instruments LM3444 Evaluation Boards LM3444-120VFLBK/NOPB LM3444-120VFLBK/NOPB Datenbogen
Produktcode
LM3444-120VFLBK/NOPB
SNVS682C – NOVEMBER 2010 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS
Limits in standard type face are for T
J
= 25°C and those with boldface type apply over the full Operating Temperature
Range ( T
J
=
−
40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: V
CC
= 12V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
CC
SUPPLY
I
VCC
Operating supply current
1.58
2.25
mA
V
CC-UVLO
Rising threshold
7.4
7.7
V
Falling threshold
6.0
6.4
Hysterisis
1
COFF
V
COFF
Time out threshold
1.22
1.276
1.327
V
5
R
COFF
Off timer sinking impedance
33
60
Ω
t
COFF
Restart timer
180
µs
CURRENT LIMIT
V
ISNS
ISNS limit threshold
1.17
1.269
1.364
V
4
t
ISNS
Leading edge blanking time
125
ns
Current limit reset delay
180
µs
ISNS limit to GATE delay
ISNS = 0 to 1.75V step
33
ns
CURRENT SENSE COMPARATOR
V
FILTER
FILTER open circuit voltage
720
750
780
mV
R
FILTER
FILTER impedance
1.12
M
Ω
V
OS
Current sense comparator offset voltage
-4.0
0.1
4.0
mV
GATE DRIVE OUTPUT
V
DRVH
GATE high saturation
I
GATE
= 50 mA
0.24
0.50
V
V
DRVL
GATE low saturation
I
GATE
= 100 mA
0.22
0.50
I
DRV
Peak souce current
GATE = V
CC
/2
-0.77
A
Peak sink current
GATE = V
CC
/2
0.88
t
DV
Rise time
C
load
= 1 nF
15
ns
Fall time
C
load
= 1 nF
15
THERMAL SHUTDOWN
T
SD
Thermal shutdown temperature
See
(1)
165
°C
Thermal shutdown hysteresis
20
THERMAL SPECIFICATION
R
θ
JA
VSSOP junction to ambient
124
°C/W
R
θ
JC
VSSOP junction to case
76
(1)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125°C), the maximum power dissipation
of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (R
θ
JA
), as
given by the following equation: T
A-MAX
= T
J-MAX-OP
– (R
θ
JA
× P
D-MAX
).
4
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