Texas Instruments LM3410 Boost Evaluation Board LM3410XMFLEDEV/NOPB LM3410XMFLEDEV/NOPB Datenbogen
Produktcode
LM3410XMFLEDEV/NOPB
SNVS541G – OCTOBER 2007 – REVISED MAY 2013
External Components: Choose components that are efficient, and you can reduce the mutual heating between
devices.
devices.
PCB design with thermal performance in mind:
The PCB design is a very important step in the thermal design procedure. The LM3410 is available in three
package options (5-pin SOT-23, 8-pin MSOP-PowerPad and 6-pin WSON). The options are electrically the
same, but difference between the packages is size and thermal performance. The WSON and MSOP-PowerPad
have thermal Die Attach Pads (DAP) attached to the bottom of the packages, and are therefore capable of
dissipating more heat than the SOT-23 package. It is important that the customer choose the correct package for
the application. A detailed thermal design procedure has been included in this data sheet. This procedure will
help determine which package is correct, and common applications will be analyzed.
package options (5-pin SOT-23, 8-pin MSOP-PowerPad and 6-pin WSON). The options are electrically the
same, but difference between the packages is size and thermal performance. The WSON and MSOP-PowerPad
have thermal Die Attach Pads (DAP) attached to the bottom of the packages, and are therefore capable of
dissipating more heat than the SOT-23 package. It is important that the customer choose the correct package for
the application. A detailed thermal design procedure has been included in this data sheet. This procedure will
help determine which package is correct, and common applications will be analyzed.
There is one significant thermal PCB layout design consideration that contradicts a proper electrical PCB layout
design consideration. This contradiction is the placement of external components that dissipate heat. The
greatest external heat contributor is the external Schottky diode. It would be nice if you were able to separate by
distance the LM3410 from the Schottky diode, and thereby reducing the mutual heating effect. This will however
create electrical performance issues. It is important to keep the LM3410, the output capacitor, and Schottky
diode physically close to each other (see PCB layout guidelines). The electrical design considerations outweigh
the thermal considerations. Other factors that influence thermal performance are thermal vias, copper weight,
and number of board layers.
design consideration. This contradiction is the placement of external components that dissipate heat. The
greatest external heat contributor is the external Schottky diode. It would be nice if you were able to separate by
distance the LM3410 from the Schottky diode, and thereby reducing the mutual heating effect. This will however
create electrical performance issues. It is important to keep the LM3410, the output capacitor, and Schottky
diode physically close to each other (see PCB layout guidelines). The electrical design considerations outweigh
the thermal considerations. Other factors that influence thermal performance are thermal vias, copper weight,
and number of board layers.
Copyright © 2007–2013, Texas Instruments Incorporated
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