Texas Instruments LM3448 Evaluation Board LM3448-EDSNEV/NOPB LM3448-EDSNEV/NOPB Datenbogen
Produktcode
LM3448-EDSNEV/NOPB
SNOSB51C – SEPTEMBER 2011 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS
(continued)
V
CC
= 12V unless otherwise noted. Limits in standard type face are for T
J
= 25°C and those with boldface type apply over
the full Operating Temperature Range ( T
J
=
−
40°C to +125°C). Minimum and Maximum limits are specified through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at T
J
= +25ºC and are provided for
reference purposes only.
Symbol
Parameter
Conditions
Min
(2)
Typ
(3)
Max
(2)
Units
I
DS
SW to ISNS leakage current
(4)
SW - ISNS = 600V
1
µA
R
ON
SW to ISNS switch on resistance
3.6
Ω
THERMAL SHUTDOWN
T
SD
Thermal shutdown temperature
See
(5)
165
°C
Thermal shutdown hysteresis
20
THERMAL RESISTANCE
R
θ
JA
Junction to Ambient
See
(5) (6)
95
°C/W
(4)
High voltage devices such as the LM3448 are susceptible to increased leakage currents when exposed to high humidity and high
pressure operating environments. Users of this device are cautioned to satisfy themselves as to the suitability of this product in the
intended end application and take any necessary precautions (e.g. system level HAST/HALT testing, conformal coating, potting, etc.) to
ensure proper device operation.
pressure operating environments. Users of this device are cautioned to satisfy themselves as to the suitability of this product in the
intended end application and take any necessary precautions (e.g. system level HAST/HALT testing, conformal coating, potting, etc.) to
ensure proper device operation.
(5)
These electrical parameters are specified by design and are not verified by test.
(6)
This R
θ
JA
typical value determined using JEDEC specifications JESD51-1 to JESD51-11. However junction-to-ambient thermal
resistance is highly board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to
thermal dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (T
thermal dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125°C),
the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (R
θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (R
θ
JA
× P
D-MAX
).
Copyright © 2011–2013, Texas Instruments Incorporated
5
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