Texas Instruments Test System for BQ27000 BQ27200 Based Circuit Boards BQ27X00-TESTER BQ27X00-TESTER Datenbogen
Produktcode
BQ27X00-TESTER
www.ti.com
TYPICAL APPLICATION
UDG−04096
+
PACK−
PACK+
HDQ
ESD Protection
D2
5.6 V
5.6 V
R7
100
Ω
R8
100
Ω
R1
1 k
Ω
C1
0.1
µ
F
R2
1 k
Ω
R
S
0.02
Ω
R4
10 k
10 k
Ω
C2
0.1
0.1
µ
F
C3
0.1
0.1
µ
F
C4
0.1
µ
F
C3
0.1
µ
F
R3
1 k
1 k
Ω
Li-Ion Protector
Li-Ion
or
Li-Pol
or
Li-Pol
PGM TP
1
2
3
4
9
8
7
6
GPIO
SRP
SRN
BAT
RBI
VCC
VSS
D/C
bq27000DRK
5
HDQ
10
PGM
11
ABSOLUTE MAXIMUM RATINGS
SLUS556D – SEPTEMBER 2004 – REVISED MARCH 2006
ORDERING INFORMATION
TA
COMMUNICATION INTERFACE
PACKAGED DEVICES
(1)
MARKINGS
HDQ
bq27000DRKR
27000
-20
°
C to 70
°
C
I
2
C
bq27200DRKR
27200
(1)
The DRK package is available taped and reeled only. Quantities are 2,000 devices per reel.
over operating free-air temperature range (unless otherwise noted)
bq27000
UNITS
bq27200
V
CC
Supply voltage
(with respect to V
SS
)
-0.3 to 7
-0.3 to
SRP, SRN, RBI, BAT (all with respect to V
SS
)
V
CC
+0.3
V
HDQ, SCL, SDA, GPIO (all with respect to
V
IN
Input voltage
-0.3 to 7
V
SS
)
PGM (with respect to V
SS
) during EEPROM
-0.3 to 22
programming
I
SINK
Output sink current
GPIO, SCL, SDA, HDQ
5
mA
T
A
Operating free-air temperature range
-20 to 70
T
stg
Storage temperature range
-65 to 150
°
C
T
J
Operating junction temperature range
-40 to 125
Lead temperature (soldering, 10 sec)
300
2