Texas Instruments Evaluation Module for TLV62065 TLV62065EVM-719 TLV62065EVM-719 Datenbogen
Produktcode
TLV62065EVM-719
TLV62065EVM Assembly Drawings and Layout
www.ti.com
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TLV62065EVM Assembly Drawings and Layout
through
show the design of the TLV62065EVM-719 printed circuit board. This EVM
has been designed using a four-layer, 1-ounce, copper-clad PCB (1.8 in × 1.5 in, or 4.57 cm × 3.81 cm)
with all components in an active area on the top side of the board. All active traces are routed on the top
and bottom layers to allow the user to easily view, probe, and evaluate the TLV62065 device in a
practical, double-sided application environment. Moving components to both sides of the PCB or using
additional internal layers can offer additional size reduction for space-constrained systems.
with all components in an active area on the top side of the board. All active traces are routed on the top
and bottom layers to allow the user to easily view, probe, and evaluate the TLV62065 device in a
practical, double-sided application environment. Moving components to both sides of the PCB or using
additional internal layers can offer additional size reduction for space-constrained systems.
NOTE:
Board layouts are not to scale. These figures are intended to show how the board is laid
out; they are not intended to be used for manufacturing TLV62065EVM-719 PCBs.
Figure 16. TLV62065EVM Component Placement, Top View
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TLV62065EVM-719
SLVU424 – December 2010
© 2010, Texas Instruments Incorporated