Texas Instruments LMP8480 and LMP8481 Evaluation Tool LMP8480MEVM-S/NOPB LMP8480MEVM-S/NOPB Datenbogen
Produktcode
LMP8480MEVM-S/NOPB
Setup
4
LMP8480/81 User’s Guide
March 2013
3. Board Connections and Components
This section describes the jumpers and connectors on the EVM as well and how to properly connect, set up
the EVM board.
the EVM board.
3.1. General Safety Precautions
Connections with 48V or 1A and above should be securely soldered to the terminals to prevent inadvertent
disconnection. Voltages above 70V must be soldered. Clip-on leads are not recommended at high voltages.
Follow all standard high voltage precautions.
All power should be removed when changing connections, even in the low voltage sections. The use of hand-
held probes while powered is not recommended. Connections should be hard wired.
disconnection. Voltages above 70V must be soldered. Clip-on leads are not recommended at high voltages.
Follow all standard high voltage precautions.
All power should be removed when changing connections, even in the low voltage sections. The use of hand-
held probes while powered is not recommended. Connections should be hard wired.
3.2. Power Supply Input - VCC
The device power supply is connected to the VCC and GND pins. Positions for 4.7uF (optional) and 0.1uF
ceramic bypass capacitors are provided on the VCC lines. Note that these capacitors should be rated for
100V or more. EVM supply voltage is limited to 75V max.
ceramic bypass capacitors are provided on the VCC lines. Note that these capacitors should be rated for
100V or more. EVM supply voltage is limited to 75V max.
3.3. Current Sense Resistor and Sense Terminals - RSP and RSN
The large current sense resistor pads allow for multiple mounting configurations of both through-hole and
surface mount resistors.
WARNING: The area around the sense resistor can get warm. Use caution when handling or probing.
surface mount resistors.
WARNING: The area around the sense resistor can get warm. Use caution when handling or probing.
Figure 2: Rsense Terminals
These pads are bare copper to allow for mounting of any size or shape of resistor, as well as providing heat
dissipation. The larger inner holes are for optional pin socket receptacles (see Bill of Materials) to allow easy
swapping of through-hole resistors for prototyping.
Customer provided sense resistor power dissipation should be limited to less than 1W. The TI supplied 0.1
Ohm resistor power dissipation must be less than 0.5W. Currents higher than 5A should be soldered directly
to the sense pads. Currents above 10A should use an off-board shunt resistor with its own heat sink.
For off-board current sense resistors, the sense lines can be connected to the SENSE+ and SENSE- turret
terminals (with on-board sense resistor removed). It is recommended that these wires be twisted to prevent
noise pickup and to provide some EMI rejection.