Texas Instruments TPS61258 Chip Scale step-up dc-dc converters, 3.5-MHz high efficiency Evaluation Module TPS61258EVM-76 TPS61258EVM-766 Datenbogen
Produktcode
TPS61258EVM-766
Bill of Materials
6
Bill of Materials
lists the EVM components as configured according to the schematic shown in
Table 2. TPS6125xEVM-766 Bill of Materials
(1)
-001
-002
-003
RefDes
VALUE
Description
Size
Part Number
MFR
1
1
1
C1**
4.7 µF
Capacitor, Ceramic, 6.3V, X5R,
0402
GRM155R60J475U
muRata
20%
2
2
2
C2, C3**
10 µF
Capacitor, Ceramic, 6.3V, X5R,
0603
GRM188R60J106ME84D
muRata
20%
1
1
1
C4
150 µF
Capacitor, 6.3V, Temp 15%, ±20%,
3528(B)
T520B157M006ATE070
Kemet
70mOhm
6
6
6
J1, J2, J3, J4,
PEC02SAAN
Header, Male 2-pin, 100mil spacing, 0.100 inch x 2
PEC02SAAN
Sullins
J5, J6
0
0
0
J7, J8
Open
Connector, SMA , Straight, PC
0.210 sq inch
901-144-8RFX
AMP
mount
0
0
0
J9, J10
Open
Header, Male 2-pin, 200mil spacing, 0.100 inch x 2
PEC03SAAN
Sullins
2
2
2
JP1, JP2
PEC03SAAN
Header, Male 3-pin, 100mil spacing, 0.100 inch x 3
PEC03SAAN
Sullins
1
1
1
L1**
1.0 µH
Inductor, SMT Multi-layer, 3.7A,
3225
DFE322512C1R0
TOKO
34milliohm
1
0
0
U1
TPS61253
IC, TINY 1.5-A 3.5-MHz BOOST
BGA
TPS61253YFF
TI
CONVERTER, 5.0V
0
1
0
U1
TPS61258
IC, TINY 1.5-A 3.5-MHz BOOST
BGA
TPS61258YFF
TI
CONVERTER, 4.5V
0
0
1
U1
TPS61259
IC, TINY 1.5-A 3.5-MHz BOOST
BGA
TPS61259YFF
TI
CONVERTER, 5.1V
(1)
Notes:
1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
5. Install label in silkscreened box after final wash. Text shall be 8 pt font. Text shall be per Table 1.
1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
5. Install label in silkscreened box after final wash. Text shall be 8 pt font. Text shall be per Table 1.
13
SLVU744 – August 2012
TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale
Packaging EVM
Copyright © 2012, Texas Instruments Incorporated