Texas Instruments OPA653EVM Evaluation Module OPA653EVM OPA653EVM Datenbogen
Produktcode
OPA653EVM
+
+
6
2
-
7
4
3
+
N/C
www.ti.com
SBOS348A – DECEMBER 2008 – REVISED NOVEMBER 2009
For proper operation, the PowerPAD must be tied to
For more general data and detailed information about
the most negative supply voltage. It is recommended
the PowerPAD package, refer to the PowerPAD™
to use five evenly-spaced vias under the device as
Thermally
Enhanced
Package
application
note
shown in the EVM layer views (see
space
EVALUATION MODULE
Schematic and PCB Layout
is the OPA653EVM schematic. Layers 1 through 4 of the PCB are shown in
. It is
recommended to follow the layout of the external components near to the amplifier, ground plane construction,
and power routing as closely as possible.
and power routing as closely as possible.
Figure 26. OPA653EVM Schematic
Figure 27. OPA653EVM PCB Layers 1 through 4
Copyright © 2008–2009, Texas Instruments Incorporated
13
Product Folder Link(s):