Texas Instruments THS770006 Evaluation Module THS770006EVM THS770006EVM Datenbogen
Produktcode
THS770006EVM
100
W
50
W
50
W
100
W
V
OCM
NC
PD
V
IN
-
V
IN+
V
OCM
NC
NC
Unused
V
OUT+
V
OUT
-
Unused
NC
1
2
3
4
5
6
18
17
16
15
14
13
NC
24
NC
7
V
S+
23
GND
8
V
S+
22
GND
9
V
S+
21
GND
10
V
S+
20
GND
11
NC
19
NC
12
SBOS520B
–
JULY 2010
–
REVISED JANUARY 2012
PIN CONFIGURATION
RGE PACKAGE
VQFN-24
(TOP VIEW)
PIN DESCRIPTIONS
PIN
NO.
NAME
DESCRIPTION
1
NC
No internal connection
2
PD
Power down. High = low power (sleep) mode. Low = active.
3
V
IN
–
Inverting input pin
4
V
IN+
Noninverting input pin
5
V
OCM
Output common-mode voltage control input pin
6, 7
NC
No internal connection
8, 9, 10, 11
GND
Ground. Must be connected to thermal pad.
12, 13
NC
No internal connection
14
Unused Bonded to die, but not used. Tie to GND.
15
V
OUT
–
Inverting output pin
16
V
OUT+
Noninverting output pin
17
Unused Bonded to die, but not used. Tie to GND.
18, 19
NC
No internal connection
20, 21, 22,
V
S+
Power supply pins, +5V nominal
23
24
NC
No internal connection
Thermal pad
Thermal pad on bottom of device is used for heat dissipation and must be tied to GND
6
Copyright
©
2010
–
2012, Texas Instruments Incorporated
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