Texas Instruments TPS61170EVM-280 Evaluation Module TPS61170EVM-280 TPS61170EVM-280 Datenbogen
Produktcode
TPS61170EVM-280
Setup and Test Results
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1.2
Performance Specification Summary
provides a summary of the TPS61170EVM performance specifications. All specifications are given
for an ambient temperature of 25°C.
Table 1. Performance Specification Summary
SPECIFICATION
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
IN
9
18
V
V
OUT
(1)
V
IN
= 9 V, I
OUT
< 250 mA
23.1
24
24.9
V
V
IN
= 18 V , I
OUT
< 550 mA
(1)
Minimum and maximum values include 1% resistor tolerance as well as IC feedback reference voltage tolerance.
1.3
Modifications
Because the primary goal of the EVM is to demonstrate the small size of the TPS61170 power supply
solution, capacitors and inductors with small footprints were chosen. These capacitors and inductors were
carefully selected to maximize efficiency and minimize ripple while minimizing overall solution size.
Changing components could improve or degrade EVM performance.
solution, capacitors and inductors with small footprints were chosen. These capacitors and inductors were
carefully selected to maximize efficiency and minimize ripple while minimizing overall solution size.
Changing components could improve or degrade EVM performance.
The TPS61170 integrated circuit (IC) has a maximum input voltage of 18 V and can boost its input voltage
up to 37 V. Changes to this EVM's operating input and output voltage range likely requires changing one
or more of the following components: Schottky diode, input or output capacitors, inductor, feedback
resistors, or error amplifier compensation components. Consult the data sheet and/or design tools for
assistance in selecting these components for your application.
up to 37 V. Changes to this EVM's operating input and output voltage range likely requires changing one
or more of the following components: Schottky diode, input or output capacitors, inductor, feedback
resistors, or error amplifier compensation components. Consult the data sheet and/or design tools for
assistance in selecting these components for your application.
NOTE:
When modifying the REV A version of this PCB, it is strongly recommended that you heat
the PCB on a hot plate before using a soldering iron to remove/replace components,
especially the input capacitor and inductor. Otherwise, the expansion when soldering and
contraction when cooling of the wide traces/places connecting these components to the IC
pins can damage the IC. For further explanation and guidance, see the TI application report
QFN/SON PCB Attachment {
especially the input capacitor and inductor. Otherwise, the expansion when soldering and
contraction when cooling of the wide traces/places connecting these components to the IC
pins can damage the IC. For further explanation and guidance, see the TI application report
QFN/SON PCB Attachment {
}.
2
Setup and Test Results
This section describes how to properly connect, set up, and use the TPS61170EVM.
2.1
Input/Output Connections
The connection points are described in the following paragraphs.
2.1.1
J1-VIN
This header is the positive connection to the input power supply. Twist the leads to the input supply, and
keep them as short as possible.
keep them as short as possible.
2.1.2
J2-GND
This header is the return connection to the input power supply.
2.1.3
J3-VOUT
This header is the positive output for the device.
2.1.4
J4-GND
This header is the return connection for the load.
2
TPS61170EVM-280
SLVU222C – December 2007 – Revised September 2009
Copyright © 2007–2009, Texas Instruments Incorporated