Texas Instruments TMS320C6472 Evaluation Module TMDSEVM6472LE TMDSEVM6472LE Datenbogen
Produktcode
TMDSEVM6472LE
PRODUCTPREVIEW
SPRS612G
–
JUNE 2009
–
REVISED JULY 2011
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This revision history highlights the technical changes made to the document in this revision.
C6472 Revisions
SEE
ADDITIONS/MODIFICATIONS/DELETIONS
Features:
Added CTZ package to Features list item
Changed section title to: CTZ/ZTZ BGA Package (Bottom View)
Changed
caption to: CTZ/ZTZ 737-Pin Ball Grid Array (BGA) Package (Bottom View)
Device Characteristics:
Modified Description for BGA Package in
, Characteristics of the C6472 Processor
Device and Development-Support Tool Nomenclature:
Modified
, TMS320C64x+
™
DSP Device Nomenclature (including the TMS320C6472 DSP)
EDMA3 Peripheral Register Descriptions:
Added DMAQNUM4-7 to
, EDMA3 Registers
Thermal Data:
Changed
title to: Thermal Resistance Characteristics (S-PBGA Package) [CTZ/ZTZ]
Packaging Information:
Added CTZ mechanical package drawing
6
Contents
Copyright
©
2009
–
2011, Texas Instruments Incorporated
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