Texas Instruments THS7320YHCEVM Evaluation Module THS7320YHCEVM THS7320YHCEVM Datenbogen
Produktcode
THS7320YHCEVM
SBOS565B – JULY 2011 – REVISED SEPTEMBER 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
TRANSPORT MEDIA,
PACKAGED DEVICES
PACKAGE TYPE
PACKAGE MARKING
QUANTITY
ECO STATUS
(2)
THS7320IYHCR
DSBGA (9-Ball WCSP)
QJK
Tape and Reel, 3000
Pb-Free, Green
THS7320IYHCT
DSBGA (9-Ball WCSP)
QJK
Tape and Reel, 250
Pb-Free, Green
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at
device product folder at
(2)
Eco-Status information. Additional details including specific material content can be accessed at
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to
Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total
product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
Supply voltage, V
S+
to GND
–0.4 to +5.5
V
Video input voltage, video enable pin
–0.4 to V
S+
+ 0.4
V
Output current, I
O
±75
mA
Continuous power dissipation
See Thermal Information table
Maximum junction temperature, any condition
(2)
, T
J
+150
°C
Maximum junction temperature, continuous operation, long-term reliability
(3)
, T
J
+125
°C
Storage temperature range, T
stg
+300
°C
Human body model (HBM)
6000
V
ESD ratings: all pins
Charge device model (CDM)
1000
V
Machine model (MM)
200
V
ESD ratings: video output pins
IEC 61000-4-2 contact discharge
20
kV
(1)
Stresses these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those
specified is not implied.
device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those
specified is not implied.
(2)
The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3)
The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
temperature may result in reduced reliability and/or lifetime of the device.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Supply voltage, V
S+
2.6
3
5
V
Ambient temperature, T
A
–40
+85
°C
2
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