Texas Instruments BQ51050BEVM-764 Evaluation Module BQ51050BEVM-764 BQ51050BEVM-764 Datenbogen

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BQ51050BEVM-764
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HOST
C
4
C
3
R
4
D
1
NTC
PACK +
PACK-
bq5105x
BAT
TERM
AD
AD-EN
CHG
EN2
C
1
C
2
C
BOOT1
C
BOOT2
AC1
AC2
COMM2
CLAMP2
C
COMM2
C
CLAMP2
COIL
BOOT1
RECT
TS
BOOT2
CLAMP1
C
CLAMP1
C
COMM1
COMM1
Bi-State
R
5
Tri-State
USB or
AC Adapter
Input
C
5
Wired
Charger
PGND
ILIM
R
FOD
FOD
R
1
R
OS
SLUSB42D – JULY 2012 – REVISED JANUARY 2014
THERMAL INFORMATION
YFP
RHL
THERMAL METRIC
(1)
UNITS
28-PINS
20-PINS
θ
JA
Junction-to-ambient thermal resistance
58.9
37.7
θ
JCtop
Junction-to-case (top) thermal resistance
0.2
35.5
θ
JB
Junction-to-board thermal resistance
9.1
13.6
°C/W
ψ
JT
Junction-to-top characterization parameter
1.4
0.5
ψ
JB
Junction-to-board characterization parameter
8.9
13.5
θ
JCbot
Junction-to-case (bottom) thermal resistance
n/a
2.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
space
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
IN
Input voltage range
RECT
4.0
10.0
V
I
IN
Input current
RECT
1.5
A
I
BAT
BAT(output) current
BAT
1.5
A
I
AD-EN
Sink current
AD-EN
1
mA
I
COMM
COMM sink current
COMM
500
mA
T
J
Junction temperature
0
125
°C
TYPICAL APPLICATION SCHEMATIC
Figure 2. bq5105x Used as a Wireless Power Receiver and Li-Ion/Li-Pol Battery Charger
Copyright © 2012–2014, Texas Instruments Incorporated
3
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