Texas Instruments SMA breakout daughterboard for TLK10034 TLK10034SMAEVM TLK10034SMAEVM Datenbogen
Produktcode
TLK10034SMAEVM
TLK10034 EVM USB Dongle Board Layout
Table 4. TLK10034 EVM USB Dongle Board Layer Construction
Subclass Name Type
Material
Thickness (MIL)
Dielectric
Width (MIL)
Coupling Type /
Constant
Spacing (MIL)
SURFACE
AIR
1
TOP
CONDUCTOR
COPPER
2
1
8.5 (Single)
None/None (Single)
DIELECTRIC
FR-4
5
4.5
L2_GND
PLANE
COPPER
1.2
1
DIELECTRIC
FR-4
45
4.5
L3_PWR
PLANE
COPPER
1.2
1
DIELECTRIC
FR-4
5
4.5
BOTTOM
CONDUCTOR
COPPER
2
1
8.5 (Single)
None/None (Single)
SURFACE
AIR
NOTE:
The impedance is set at slightly less than 50 or 100
Ω
on the traces to compensate for slight
over-etching during the manufacturing process. The end impedance after etching should
result in a 50- or 100-
result in a 50- or 100-
Ω
impedance. Always consult with your board manufacturer for their
process and design requirements, ensuring the desired impedance is achieved.
76
TLK10034 Quad-Channel XAUI/10GBASE-KR Transceiver Evaluation
SLLU168 – August 2012
Module (EVM)
Copyright © 2012, Texas Instruments Incorporated