Texas Instruments TMDSEMU560V2STM-U - Blackhawk XDS560v2 System Trace USB Emulator TMDSEMU560V2STM-U TMDSEMU560V2STM-U Datenbogen

Produktcode
TMDSEMU560V2STM-U
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Mechanical Specifications
2-5
Hardware
The emulator pod cable assembly is designed to operate within a relative hu-
midity of 20%−70%, Non Condensing. Operation of any electronic products
outside of this range could permanently damage your equipment.
Care should be taken regarding moisture condensation and static discharge
(ESD).
2.1.3
Physical Specifications
The emulator pod cable assembly has been designed to withstand normal flex,
Angle, Twist, Force, Strain, and Jerk operations. The chart below indicates the
minimum criteria deemed acceptable for laboratory grade debug equipment
such as the XDS560 emulator pod cable assembly
Table 2−1. Emulator Cable Specification
Test
Description
Cycles
Set Up Criteria
Flex
100,000
90
°
 flex bend during test
Angle
50,000
30
°
 angle bend during test
Twist
5,000
180
°
 twist across short axis during test
Force 
(Gurney)
1,000
50lb, 6” diameter, 1.25” wide wheel
Strain
1
10lb weight applied, vertically for 2 hours
Jerk
1
1lb weight dropped from a height of 3’
The cable assembly has been tested to withstand these criteria; any failure
indicates excessive or incorrect usage or conditions outside of these
parameters.
2.1.4
PCI
For more information concerning the PCI 2.2 standard, refer to the latest stan-
dards. Standards can be obtained directly from PCISIG (PCI Special Interest
Group (PCI-SIG)
Web Address:
http://www.pcisig.com
Address:
5440 SW Westgate Dr., #217
Portland, OR 97221
Phone:
(503) 291−2569
FAX:
(503)297−1090