Texas Instruments TAS5614LA and TAS5612LA Evaluation Module TAS5614LADDVEVM TAS5614LADDVEVM Datenbogen
Produktcode
TAS5614LADDVEVM
B1
B1
B2
SLAS846 – MAY 2012
Note B1: A wide PVDD bus and a wide ground path must be used to provide very low impedance to high power and
audio currents to the power supply. Top and bottom ground planes must be connected with vias at many points to
reinforce the ground connections.
audio currents to the power supply. Top and bottom ground planes must be connected with vias at many points to
reinforce the ground connections.
Note B2: Wide output traces can be routed on the bottom layer and connected to output pins with strong via arrays.
Figure 17. Printed Circuit Board - Bottom Layer
Copyright © 2012, Texas Instruments Incorporated
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