Texas Instruments DRV8301-LS31-KIT - TMS570LS31 Hercules Safety MCU Motor Control Kit DRV8301-LS31-KIT DRV8301-LS31-KIT Datenbogen
Produktcode
DRV8301-LS31-KIT
SLOS719B – AUGUST 2011 – REVISED AUGUST 2013
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
UNITS
MIN
MAX
PVDD
Supply voltage range including transient
Relative to PGND
–0.3
70
V
PVDD
RAMP
Maximum supply voltage ramp rate
Voltage rising up to PVDD
MAX
1
V/µS
V
PGND
Maximum voltage between PGND and GND
±0.3
V
I
IN_MAX
Maximum current for all digital and analog inputs (INH_A, INL_A, INH_B, INL_B,
±1
mA
INH_C, INL_C, SCLK, SCS, SDI, EN_GATE, DC_CAL, DTC)
I
IN_OD_MAX
Maximum sinking current for open drain pins (FAULT and OCTW Pins)
7
mA
V
OPA_IN
Voltage range for SPx and SNx pins
±0.6
V
V
LOGIC
Input voltage range for logic/digital pins (INH_A, INL_A, INH_B, INL_B, INH_C,
-0.3
7
V
INL_C, EN_GATE, SCLK, SDI, SCS, DC_CAL)
V
GVDD
Maximum voltage for GVDD Pin
13.2
V
V
AVDD
Maximum voltage for AVDD Pin
8
V
V
DVDD
Maximum voltage for DVDD Pin
3.6
V
V
VDD_SPI
Maximum voltage for VDD_SPI Pin
7
V
V
SDO
Maximum voltage for SDO Pin
VDD_SPI +0.3
V
V
REF
Maximum reference voltage for current amplifier
7
V
I
REF
Maximum current for REF Pin
100
µA
T
J
Maximum operating junction temperature range
–40
150
°C
T
STORAGE
Storage temperature range
–55
150
°C
Capacitive discharge model
500
V
Human body model
2000
V
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
DRV8301
THERMAL METRIC
(1)
DCA
UNITS
(56) PINS
θ
JA
Junction-to-ambient thermal resistance
30.3
θ
JCtop
Junction-to-case (top) thermal resistance
33.5
θ
JB
Junction-to-board thermal resistance
17.5
°C/W
ψ
JT
Junction-to-top characterization parameter
0.9
ψ
JB
Junction-to-board characterization parameter
7.2
θ
JCbot
Junction-to-case (bottom) thermal resistance
0.9
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
6
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