Texas Instruments BQ51013AEVM-765 Integrated Wireless Power Receiver Solution, Qi Evaluation Module (QFN Package) BQ5101 BQ51013AEVM-765 Datenbogen
Produktcode
BQ51013AEVM-765
Layout Guidelines
7
Layout Guidelines
The primary concerns when layout a custom receiver PCB are:
•
AC1 and AC2 trace resistance
•
OUT trace resistance
•
RECT trace resistance
•
GND connection
•
Copper weight
≥
2oz
For a 1A application the current rating for each net is as follows:
•
AC1 = AC2 = 1.2 A
•
BOOT1 = BOOT2 = 10 mA
•
RECT = 1 A
•
OUT = 1 A
•
COM1 = COM2 = 300 mA
•
CLAMP1 = CLAMP2 = 500 mA
•
ILIM = 10 mA
•
AD = AD_EN = TS-CTRL = EN1 = EN2 = TERM = FOD = 1 mA
•
CHG = 10 mA
It is also recommended to have the following capacitance on RECT and OUT:
•
RECT
≥
10
μ
F
•
OUT
≥
1
μ
F
It is always good practice to place high frequency bypass capacitors next to RECT and OUT of 0.1
μ
F. It
is also recommended to place vias directly underneath the QFN power-pad to optimize thermal flow to the
GND copper.
GND copper.
illustrates an example of a QFN layout:
Figure 10. QFN Layout
12
bq51013AEVM-765 Evaluation Module (QFN Package)
SLUU911A – June 2012 – Revised October 2012
Copyright © 2012, Texas Instruments Incorporated