Texas Instruments Evaluation Module for TPS61183 IC TPS61183EVM-528 TPS61183EVM-528 Datenbogen
Produktcode
TPS61183EVM-528
Test Requirements and Setup
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Test Requirements and Setup
6.1
Hardware Requirements
This EVM requires an external power supply capable of providing up to 24V at 3A.
If dimming via an external PWM signal is desired, then a function generator capable of providing a PWM
signal between 100 Hz to 22 kHz is required to avoid screen flickering and maintain dimming linearity.
signal between 100 Hz to 22 kHz is required to avoid screen flickering and maintain dimming linearity.
6.2
Hardware Setup
•
Connect a power supply capable of supplying up to 24 V at 3 A between the VIN pin and GND (J1 and
J3). Do not turn on the power supply.
J3). Do not turn on the power supply.
•
JP1 should be connected directly or through an ammeter to the high side of external LED strings. Or,
the shunt installed or replaced with an ammeter and the WLEDEVM-260 or WLEDEVM-461 connected
to J4.
the shunt installed or replaced with an ammeter and the WLEDEVM-260 or WLEDEVM-461 connected
to J4.
•
Either use JP2 or connect a voltage source supplying at least 2.1-V but no more than 20-V signal to
the high impedance EN pin (JP2) referenced to the same ground as J3.
the high impedance EN pin (JP2) referenced to the same ground as J3.
•
For PWM Dimming, either use JP3 or connect a second logic signal capable of providing at least 2.1-V
but no more than 20-V signal to the PWM input.
but no more than 20-V signal to the PWM input.
•
Properly configure JP4-JP9 so that each IFB line either connects directly to an LED string, to the J4
connector, or to GND. Unused IFBx lines should have the appropriate JP4-JP9 jumpers shunted to
ground.
connector, or to GND. Unused IFBx lines should have the appropriate JP4-JP9 jumpers shunted to
ground.
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TPS61183EVM-528 Assembly Drawings and Layout
The following figures (
through
) show the design of the TPS61183EVM-528 printed
circuit board. The EVM has been designed using a 2-Layer, 2oz copper-clad circuit board 6.58 cm × 5.44
cm with all components in a 1.9cm × 2.2cm active area on the top side and all active traces to the top and
bottom layers to allow the user to easily view, probe and evaluate the TPS61195 control IC in a practical
double-sided application. Moving components to both sides of the PCB or using additional internal layers
can offer additional size reduction for space constrained systems.
cm with all components in a 1.9cm × 2.2cm active area on the top side and all active traces to the top and
bottom layers to allow the user to easily view, probe and evaluate the TPS61195 control IC in a practical
double-sided application. Moving components to both sides of the PCB or using additional internal layers
can offer additional size reduction for space constrained systems.
Figure 2. TPS61183EVM-528 Component Placement (Viewed from Top)
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TPS61183EVM-528
SLVU363 – July 2010
Copyright © 2010, Texas Instruments Incorporated