Texas Instruments TPA3130D2 Evaluation Module TPA3130D2EVM TPA3130D2EVM Datenbogen
Produktcode
TPA3130D2EVM
> 1.4sec
mP
TPA3116D2
SDZ
MUTE
FAULTZ
SDZ
MUTE
FAULTZ
SLOS708C – APRIL 2012 – REVISED NOVEMBER 2013
Table 5. DC Detect Threshold
PV
CC
(V)
V
OS
- OUTPUT OFFSET VOLTAGE (V)
4.5
0.96
6
1.30
12
2.60
18
3.90
SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE
The TPA31xxD2 family has protection from over current conditions caused by a short circuit on the output stage.
The short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched
to a high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling
the SDZ pin through the low state.
The short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched
to a high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling
the SDZ pin through the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the short-
circuit protection latch.
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the short-
circuit protection latch.
In systems where a possibility of a permanent short from the output to PVDD or to a high voltage battery like a
car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a high-
Z restart, like shown in the figure below:
car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a high-
Z restart, like shown in the figure below:
Figure 29. MUTE Driven by Inverted FAULTZ
Figure 30. Timing Requirement for SDZ
THERMAL PROTECTION
Thermal protection on the TPA31xxD2 family prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
Thermal protection faults are reported on the FAULTZ terminal as a low state.
If automatic recovery from the thermal protection latch is desired, connect the FAULTZ pin directly to the SDZ
pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal
protection latch.
pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal
protection latch.
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