Texas Instruments IC MCU 16B MSP430F2418TPM LQFP-64 TID MSP430F2418TPM Datenbogen
Produktcode
MSP430F2418TPM
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
1
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
4040152 / C 11/96
32
17
0,13 NOM
0,25
0,45
0,75
Seating Plane
0,05 MIN
Gage Plane
0,27
33
16
48
1
0,17
49
64
SQ
SQ
10,20
11,80
12,20
9,80
7,50 TYP
1,60 MAX
1,45
1,35
1,35
0,08
0,50
M
0,08
0
°
– 7
°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. May also be thermally enhanced plastic with leads connected to the die pads.
D. May also be thermally enhanced plastic with leads connected to the die pads.