Texas Instruments Evaluation Board for High-Speed Dual Op Amp in the 8-Pin SOIC PSOP Package LMH730121/NOPB LMH730121/NOPB Datenbogen
Produktcode
LMH730121/NOPB
2001 National Semiconductor Corporation www.national.com
2
DAP Connection:
CLC730121 evaluation board can be used with two types of Op Amps:
1. Op Amp’s with DAP internally floating. (no board change required)
2. Op Amp’s with DAP internally tied to V
2. Op Amp’s with DAP internally tied to V
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(see below for modifications needed to the board)
CLC730121 DAP heatsink connection is tied to ground. With “type 2” devices listed above, it will be necessary to
disconnect the DAP connection from ground and tie it to V
disconnect the DAP connection from ground and tie it to V
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instead (see instructions below). Consult the datasheet for
each device for information on DAP connection and whether this modification is required for the particular device.
MODIFICATIONS TO ISOLATE HEATSINK FROM GND AND TIE IT TO V
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Circuit Side
Modification
Modification
Circuit Side
Modification
Modification