Texas Instruments Evaluation Module for TPS720105 TPS720105DRVEVM TPS720105DRVEVM Datenbogen
Produktcode
TPS720105DRVEVM
DEVICE INFORMATION
Thermal
Shutdown
Current
Limit
UVLO
Bandgap
IN
EN
OUT
BIAS
PIN CONFIGURATION
IN
GND
BIAS
6
5
4
OUT
NC
EN
1
2
3
Thermal
Pad
(1)
BIAS
IN
EN
GND
OUT
C3
B2
A3
C1
A1
TPS720xx
www.ti.com
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SBVS100D – JUNE 2008 – REVISED AUGUST 2009
Functional Block Diagram
DRV PACKAGE
YZU PACKAGE
SON-6
WCSP-5
(TOP VIEW)
(TOP VIEW)
(1)
It is recommended that the SON (DRV)
package thermal pad be connected to
ground.
package thermal pad be connected to
ground.
PIN DESCRIPTIONS
TPS720xx
NAME
DRV
YZU
DESCRIPTION
Output pin. A 2.2
µ
F ceramic capacitor is connected from this pin to ground, for stability and to provide load
OUT
1
A3
transients. See
in the Application Information section.
NC
2
—
No connection.
Enable pin. A logic high signal on this pin turns the device on and regulates the voltage from IN to OUT. A
EN
3
C3
logic low on this pin turns off the device.
Bias supply pin. It is recommended that this input be bypassed with a ceramic capacitor to ground for better
BIAS
4
C1
transient performance. See
in the Application Information section.
GND
5
B2
Ground pin.
Input pin. This pin can be a maximum of 4.5V; V
IN
must not exceed V
BIAS
. Bypass this input with a ceramic
IN
6
A1
capacitor to ground. See
in the Application Information section.
Copyright © 2008–2009, Texas Instruments Incorporated
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