Texas Instruments IC MCU 16B MSP430F2232TDA TSSOP-38 TID MSP430F2232TDA Datenbogen
Produktcode
MSP430F2232TDA
A1
A2
A4
A3
A5
A6
A7
TOP VIEW
B1
B2
B4
B3
B5
B6
B7
C1
C2
C4
C3
C5
C6
C7
D1
D2
D4
D3
D5
D6
D7
E1
E2
E4
E3
E5
E6
E7
F1
F2
F4
F3
F5
F6
F7
G1
G2
G4
G3
G5
G6
G7
MSP430F22x2
MSP430F22x4
MSP430F22x4
SLAS504G – JULY 2006 – REVISED AUGUST 2012
MSP430F22x4, MSP430F22x2 Device Pinout, YFF Package
Package Dimensions
The package dimensions for this YFF package are shown in
. See the package drawing at the end of this
data sheet for more details.
Table 2. YFF Package Dimensions
PACKAGED DEVICES
D
E
MSP430F22x2
3.33 ± 0.03 mm
3.49 ± 0.03 mm
MSP430F22x4
6
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