Texas Instruments Evaluation Module for TPS65910 TPS65910EVM-583 TPS65910EVM-583 Datenbogen
Produktcode
TPS65910EVM-583
List of Materials
8
List of Materials
lists the EVM components as configured according to the schematic shown in
Table 11. TPS65910 EVM Bill of Materials
COUNT
REFDES
VALUE
DESCRIPTION
SIZE
PART NUMBER
MFR
Capacitor,
1
C1
0.2 F
Electric Double
AK
EECEN0F204AK
Panasonic
Layer
Capacitor,
1
C11
0.10 µF
Ceramic, 10 V,
0402
STD
{MFR}
X5R, 10%
C14, C15, C16,
Capacitor,
JMK105BJ225M
9
C17, C18, C19,
2.2 µF
Ceramic, 6.3 V,
0402
Taiyo Yuden
V-F
C20, C21, C22
X5R, 20%
Capacitor,
C2, C3, C6, C10,
JMK107BJ475K
5
4.7 µF
Ceramic, 6.3 V,
0603
Taiyo Yuden
C12
A-T
X5R, 20%
Capacitor,
2
C4, C5
12 pF
Ceramic, vvV,
0402
{Part Number}
{MFR}
[temp], [tol]
C7, C8, C9, C13,
Capacitor,
C0603C106M9P
9
C23, C24, C25,
10 µF
Ceramic, 6.3 V,
0603
Kemet
AC
C26, C27
X5R, 20%
Diode, Schottky,
1
D1
MSS1P2L
MicroSMP
MSS1P2L
Vishay
20 V, 1 A
Connector, Male
Right Angle
2
J1, J2
2510-5002UB
0.100 inch x 2X5
2510-5002UB
3M
2x5 pin, 100 mil
spacing, 4 Wall
J3, J4, J5, J12,
J21, J22, J23,
J24, J25, J26,
J27, J28, J29,
J24, J25, J26,
J27, J28, J29,
Header, Male 2-
26
J30, J31, J32,
PEC02SAAN
pin, 100 mil
0.100 inch x 2
PEC02SAAN
Sullins
J33, J34, J35,
spacing
J36, J37, J38,
J39, J40, J41,
J39, J40, J41,
J42
J6, J7, J8, J9,
Header, Male 3-
J10, J11, J13,
13
PEC03SAAN
pin, 100 mil
0.100 inch x 3
PEC03SAAN
Sullins
J14, J16, J17,
spacing
J18, J19, J20
Inductor, SMT,
0.157 x 0.157
VLCF5020T-
3
L1, L2, L3
2.2 µH
TDK
2.6 A, 58 m
Ω
inch
2R2N2R6-3
MIPF2520D4R7
FDK
S
Inductor, SMT
1
L4
4.7 µH
Multi-layer, 1 A,
2520 mm
Alternate part:
110 m
Ω
LQM2HPN4R7M
Murata
G0L
R1, R7, R10,
Resistor, Chip,
4
1.5 k
Ω
0603
STD
STD
R12
1/16 W, 5%
Resistor, Chip,
2
R11, R13
10 k
Ω
0603
STD
STD
1/16 W, 5%
Resistor, Chip,
R14
10 k
Ω
0603
STD
STD
1/16 W, 5%
R2, R3, R4, R5,
Resistor, Chip,
7
0
0603
STD
STD
R6, R8, R9
1/16 W, 5%
Switch, 1P1T, 50
0.200 x 0.200
1
S1
EVQ-PLHA15
EVQ-PLHA15
Panasonic
mA, 12 V, 160 g
inch
1
SH1
Short jumper
18
Introduction
SWCU065F – March 2010 – Revised April 2013
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