Microchip Technology SST39LF400A-55-4C-EKE Memory IC TSOP-48 SST39LF400A-55-4C-EKE Datenbogen
Produktcode
SST39LF400A-55-4C-EKE
© 2011 Silicon Storage Technology, Inc.
DS25001A
03/11
29
2 Mbit / 4 Mbit / 8 Mbit Multi-Purpose Flash
SST39LF200A / SST39LF400A / SST39LF800A
SST39VF200A / SST39VF400A / SST39VF800A
Data Sheet
A Microchip Technology Company
Product Ordering Information
SST
39
VF
200A
-
70
-
4C
-
B3KE
XX
XX
XXXX
-
XX
-
XX
-
XXXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
K = 48 leads or balls
Q = 48 balls or bumps (66 possible posi-
tions)
Q = 48 balls or bumps (66 possible posi-
tions)
Package Type
B3 = TFBGA (0.8mm pitch, 6mm x 8mm)
C1 = XFLGA (0.5mm pitch, 4mm x 6mm)
E = TSOP (type 1, die up, 12mm x 20mm)
M1 = WFBGA (0.5mm pitch, 4mm x 6mm)
MA = WFBGA (0.5mm pitch, 4mm x 6mm)
C1 = XFLGA (0.5mm pitch, 4mm x 6mm)
E = TSOP (type 1, die up, 12mm x 20mm)
M1 = WFBGA (0.5mm pitch, 4mm x 6mm)
MA = WFBGA (0.5mm pitch, 4mm x 6mm)
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
55 = 55 ns
70 = 70 ns
70 = 70 ns
Version
A = Special Feature Version
Device Density
800 = 8 Mbit
400 = 4 Mbit
200 = 2 Mbit
400 = 4 Mbit
200 = 2 Mbit
Voltage
L = 3.0-3.6V
V = 2.7-3.6V
V = 2.7-3.6V
Product Series
39 = Multi-Purpose Flash
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.