Microchip Technology DM240312 Datenbogen
PIC24FJ256DA210 Development Board User’s Guide
DS51911A-page 32
2010 Microchip Technology Inc.
FIGURE 4-1:
PIC24FJ256DA210 DEVELOPMENT BOARD BLOCK
DIAGRAM
DIAGRAM
4.3
GENERAL HARDWARE FEATURES
4.3.1
PCB Layout
The PIC24FJ256DA210 Development Board uses several design strategies to provide
a stable demonstration and development environment. Users should note these
features and design tips when developing their own graphic applications.
a stable demonstration and development environment. Users should note these
features and design tips when developing their own graphic applications.
The development board uses a four-layer PCB design; this allows high-frequency
signals to be routed in a way to avoid crosstalk between data signals. It also gives
additional noise protection due to improved grounding.
signals to be routed in a way to avoid crosstalk between data signals. It also gives
additional noise protection due to improved grounding.
For additional noise protection, oscillator circuits and crystals are laid out with appro-
priate grounding and guard rings. The layout guidelines are described in Section 2.
“Guidelines for Getting Started with 16-Bit Microcontrollers” of the device data
sheet.
priate grounding and guard rings. The layout guidelines are described in Section 2.
“Guidelines for Getting Started with 16-Bit Microcontrollers” of the device data
sheet.
Each group of color signals (Red, Green and Blue) is routed together to reduce inter-
color crosstalk. This means, for example, that Red signals are close together and do
not mix with Green and/or Blue signals. Ideally, it is recommended to run a ground wire
or trace between groups of color signals to reduce crosstalk. Also, the traces for color
data should be as close to equal length as possible, and avoid the use of vias wherever
possible.
color crosstalk. This means, for example, that Red signals are close together and do
not mix with Green and/or Blue signals. Ideally, it is recommended to run a ground wire
or trace between groups of color signals to reduce crosstalk. Also, the traces for color
data should be as close to equal length as possible, and avoid the use of vias wherever
possible.
4.3.2
Microcontroller
The development board is supplied with the PIC24FJ256DA210 microcontroller
directly soldered to the board at U2. The device is installed with the notched corner (pin
1) oriented to the lower right. Vias are provided around the device, which allow access
to all microcontroller signals; this is labelled on the board as U9. A riser may be installed
here to facilitate connections to user added components in the prototyping area.
directly soldered to the board at U2. The device is installed with the notched corner (pin
1) oriented to the lower right. Vias are provided around the device, which allow access
to all microcontroller signals; this is labelled on the board as U9. A riser may be installed
here to facilitate connections to user added components in the prototyping area.
PIC24FJ256DA210
DISPLAY
Connector
Display Panel
(TFT, CSTN, MSTN)
512 KByte
SRAM
512 Kbyte
FLASH
OTG
USB
USB
Device
3 Buttons/
Switches
USB
Host
Host
PICtail™
Plus
EPMP
Resistive
Touch
Screen
Display
SPI
SPI
RS-232
Transceiver
UART
SPI FLASH
(16MBit)
USB
ICSP™
R3
3 CTMU/
4 LEDs
Connector
Potentiometer