Microchip Technology DM164134 Datenbogen
© 2006 Microchip Technology Inc.
DS41159E-page 335
PIC18FXX8
ΔI
WDT
Module Differential Current
D022
Watchdog Timer
PIC18LFXX8
—
—
—
—
—
0.75
0.8
7
1.5
8
25
μA
μA
μA
V
DD
= 2.5V, +25
°C
V
DD
= 2.0V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +85°C
D022
Watchdog Timer
PIC18FXX8
—
—
—
—
—
7
7
7
7
7
25
25
45
25
45
μA
μA
μA
V
DD
= 4.2V, +25
°C
V
DD
= 4.2V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +125°C
D022A
ΔI
BOR
Brown-out Reset
(5)
PIC18LFXX8
—
—
—
—
—
38
42
49
42
49
50
55
65
55
65
μA
μA
μA
V
DD
= 2.0V, +25
°C
V
DD
= 2.0V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +85°C
D022A
Brown-out Reset
(5)
PIC18FXX8
—
—
—
—
—
46
49
50
49
50
65
65
75
65
75
μA
μA
μA
V
DD
= 4.2V, +25
°C
V
DD
= 4.2V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +125°C
D022B
ΔI
LVD
Low-Voltage Detect
(5)
PIC18LFXX8
—
—
—
—
—
36
40
47
40
47
50
55
65
55
65
μA
μA
μA
V
DD
= 2.0V, +25
°C
V
DD
= 2.0V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +85°C
D022B
Low-Voltage Detect
(5)
PIC18FXX8
—
—
—
—
—
44
47
47
47
47
65
65
75
65
75
μA
μA
μA
V
DD
= 4.2V, +25
°C
V
DD
= 4.2V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +125°C
D025
ΔI
TMR1
Timer1 Oscillator
PIC18LFXX8
—
—
—
—
—
6.2
6.2
7.5
6.2
7.5
40
45
55
45
55
μA
μA
μA
V
DD
= 2.0V, +25
°C
V
DD
= 2.0V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +85°C
D025
Timer1 Oscillator
PIC18FXX8
—
—
—
—
—
7.5
7.5
7.5
7.5
7.5
55
55
65
55
65
μA
μA
μA
V
DD
= 4.2V, +25
°C
V
DD
= 4.2V, -40
°C to +85°C
V
DD
= 4.2V, -40
°C to +125°C
27.1
DC Characteristics (Continued)
PIC18LFXX8
(Industrial)
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Operating temperature
-40°C
≤ T
A
≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Operating temperature
-40°C
≤ T
A
≤ +85°C for industrial
-40°C
≤ T
A
≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min
Typ
Max Units
Conditions
Legend: Rows are shaded for improved readability.
Note 1:
This is the limit to which V
DD
can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD
and V
SS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4:
For RC oscillator configuration, current through R
EXT
is not included. The current through the resistor can
be estimated by the formula Ir = V
DD
/2 R
EXT
(mA) with R
EXT
in kOhm.
5:
The LVD and BOR modules share a large portion of circuitry. The
ΔI
BOR
and
ΔI
LVD
currents are not
additive. Once one of these modules is enabled, the other may also be enabled without further penalty.