Freescale Semiconductor Eval, Demo and Development Board for MCF51MM256 TWR-MCF51MM TWR-MCF51MM Datenbogen
Produktcode
TWR-MCF51MM
Electrical Characteristics
Freescale Semiconductor
39
o
3.11 Mini-FlexBus Timing Specifications
A multi-function external bus interface called Mini-FlexBus is provided with basic functionality to
interface to slave-only devices up to a maximum bus frequency of
interface to slave-only devices up to a maximum bus frequency of
25.1666 MHz
. It can be directly connected
to asynchronous or synchronous devices such as external boot ROMs, flash memories, gate-array logic, or
other simple target (slave) devices with little or no additional circuitry. For asynchronous devices a simple
chip-select based interface can be used.
other simple target (slave) devices with little or no additional circuitry. For asynchronous devices a simple
chip-select based interface can be used.
All processor bus timings are synchronous; that is, input setup/hold and output delay are given in respect
to the rising edge of a reference clock, MB_CLK. The MB_CLK frequency is half the internal system bus
frequency.
to the rising edge of a reference clock, MB_CLK. The MB_CLK frequency is half the internal system bus
frequency.
The following timing numbers indicate when data is latched or driven onto the external bus, relative to the
Mini-FlexBus output clock (MB_CLK). All other timing relationships can be derived from these values.
Mini-FlexBus output clock (MB_CLK). All other timing relationships can be derived from these values.
6 Crystal start-up time
4
• Low range, low gain (RANGE =
0, HGO = 0)
t
CSTL-LP
—
200
—
ms
D
• Low range, high gain
(RANGE = 0, HGO = 1)
t
CSTL-HG
O
—
400
—
D
• High range, low gain
(RANGE = 1, HGO = 0)
5
t
CSTH-LP
—
5
—
D
• High range, high gain
(RANGE = 1, HGO = 1)
5
t
CSTH-HG
O
—
15
—
D
1
Data in Typical column was characterized at 3.0 V, 25C or is typical recommended value.
2
When MCG is configured for FEE or FBE mode, input clock source must be divisible using RDIV to within the range of 31.25 kHz to 39.0625 kHz.
3
When MCG is configured for PEE or PBE mode, input clock source must be divisible using RDIV to within the range of 1 MHz to 2 MHz.
4
This parameter is characterized and not tested on each device. Proper PC board layout porcedures must be followed to achieve specifications.
5
4 MHz crystal.
Table 19. XOSC (Temperature Range = –40 to 105
°
C Ambient) (continued)
#
Characteristic
Symbol
Min
Typ
1
Max
Unit
C
MCU
EXTAL
XTAL
R
S
C
2
Crystal or Resonator
R
F
C
1
MCF51MM256/128, Rev. 5