Embedded Artists GPS Receiver Board EA-ACC-023 EA-ACC-023 Datenbogen

Produktcode

EA-ACC-023

This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without

prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.

FGPMMOPA6H Data Sheet

GlobalTop Technology

Ver. V0A

Document #

5. Packing and Handling

GPS modules, like any other SMD devices, are sensitive to moisture, electrostatic discharge, and

temperature. By following the standards outlined in this document for GlobalTop GPS module

storage and handling, it is possible to reduce the chances of them being damaged during production

set-up. This document will go through the basics on how GlobalTop packages its modules to ensure

they arrive at their destination without any damages and deterioration to performance quality, as

well as some cautionary notes before going through the surface mount process.

Please read the sections II to V carefully to avoid damages permanent damages due to
moisture intake

GPS receiver modules contain highly sensitive electronic circuits and are electronic sensitive
devices and improper handling without ESD protections may lead to permanent damages to
the modules. Please read section VI for more details.

5.1 Moisture Sensitivity

GlobalTop GPS modules are moisture sensitive, and must be pre-baked before going through the

solder reflow process. It is important to know that:

GlobalTop GPS modules must complete solder reflow process in 72 hours after pre-baking.

This maximum time is otherwise known as “Floor Life”

If the waiting time has exceeded 72 hours, it is possible for the module to suffer damages during the

solder reflow process such as cracks and delamination of the SMD pads due to excess moisture

pressure.