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Linear Technology LTM8048 Demo Board, 725VDC Isolated µModule, 4.5V ≤ VIN ≤ 30V, VOUT = 5V @ 110mA to 370mA, LDO Post-Regulated Flyback Li DC1560A Datenbogen

Produktcode
DC1560A
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LTM8048
2
8048ff
For more information 
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
V
IN
, RUN, BIAS  ........................................................32V
ADJ1, SS .....................................................................5V
V
OUT1
 Relative to V
OUT
–
 ............................................16V
(V
IN
 – GND) + (V
OUT1
 – V
OUT
–
) .................................36V
V
OUT2
 Relative to V
OUT
–
 ..........................................+20V
ADJ2 Relative to V
OUT
–
 .............................................+7V
BYP Relative to V
OUT
–
 ............................................+0.6V
BIAS Above V
IN
 ........................................................ 0.1V
GND to V
OUT
–
 Isolation (Note 2) ........................725VDC
Maximum Internal Temperature (Note 3) .............. 125°C
Maximum Solder Temperature .............................. 250°C
Storage Temperature.............................. –55°C to 125°C
(Note 1)
TOP VIEW
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
BANK 2
V
OUT
–
BANK 1
V
OUT1
BANK 4
GND
BIAS
RUN
ADJ2
BYP
ADJ1
SS
BANK 5
V
IN
BANK 3
V
OUT2
BGA PACKAGE
45-LEAD (11.25mm 
× 9mm × 4.92mm)
 
T
JMAX
 = 125°C, 
θ
JA
 = 23.2°C/W, 
θ
JCbottom
 = 5.8°C/W, 
θ
JCtop
 = 23.2°C/W, 
θ
JB
 = 6.7°C/W 
WEIGHT = 1.1g, 
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION
PART NUMBER
PAD OR BALL 
FINISH
PART MARKING*
PACKAGE TYPE
MSL RATING
TEMPERATURE RANGE (NOTE 3) 
DEVICE
FINISH CODE
LTM8048EY#PBF 
SAC305 (RoHS)
LTM8048Y 
e1
BGA 
3
–40°C to 125°C 
LTM8048IY#PBF 
SAC305 (RoHS)
LTM8048Y 
e1
BGA 
3
–40°C to 125°C 
LTM8048IY 
SnPb (63/37)
LTM8048Y 
e0
BGA 
3
–40°C to 125°C 
LTM8048MPY#PBF 
SAC305 (RoHS)
LTM8048Y 
e1
BGA 
3
–55°C to 125°C 
LTM8048MPY
SnPb (63/37)
LTM8048Y 
e0
BGA 
3
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature 
ranges. *Device temperature grade is indicated by a label on the shipping 
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
•  Pb-free & Non-Pb-free Part Markings:  
www.linear.com/leadfree
•  Recommended LGA and BGA PCB Assembly and Manufacturing 
Procedures:  
www.linear.com/umodule/pcbassembly
•  BGA Package and Tray Drawings:  
www.linear.com/packaging/