On Semiconductor NCP3066 Evaluation Board NCP3066SCBCKGEVB NCP3066SCBCKGEVB NCP3066SCBCKGEVB Datenbogen
Produktcode
NCP3066SCBCKGEVB
NCP3066, NCV3066
http://onsemi.com
18
PACKAGE DIMENSIONS
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
STYLE 1:
PIN 1. AC IN
2. DC + IN
3. DC - IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. V
3. DC - IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. V
CC
1
4
5
8
F
NOTE 2
−A−
−B−
−T−
SEATING
PLANE
PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005)
B
M
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.40
10.16
0.370
0.400
B
6.10
6.60
0.240
0.260
C
3.94
4.45
0.155
0.175
D
0.38
0.51
0.015
0.020
F
1.02
1.78
0.040
0.070
G
2.54 BSC
0.100 BSC
H
0.76
1.27
0.030
0.050
J
0.20
0.30
0.008
0.012
K
2.92
3.43
0.115
0.135
L
7.62 BSC
0.300 BSC
M
---
10
---
10
N
0.76
1.01
0.030
0.040
_
_
8 LEAD PDIP
CASE 626−05
ISSUE L