Intel 1.00 GHz BX80530F1000256 Datenbogen

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The following terms are used often in this document and are explained here for clarification:

•

Processor substrate—The structure on which passive components (resistors and capacitors) 
are mounted.

•

Processor core—The processor’s execution engine.

•

S.E.P. Package—Single-Edge Processor Package, which consists of a processor substrate, 
processor core, and passive components. This package differs from the S.E.C. Cartridge as this 
processor has no external plastic cover, thermal plate, or latch arms.

•

PPGA package—Plastic Pin Grid Array package. The package is a pinned laminated printed 
circuit board structure.

•

FC-PGA — Flip-Chip Pin Grid Array. The FC-PGA uses the same 370-pin zero insertion 
force socket (PGA370) as the PPGA. Thermal solutions are attached directly to the back of the 
processor core package without the use of a thermal plate or heat spreader. 

•

FC-PGA2 — Flip Chip Pin Grid Array 2. The FC-PG2A uses the same 370-pin zero insertion 
force socket (PGA370) as the PPGA. The FC-PGA2 package contains an Integrated Heat 
Spreader that covers the processor die.

•

Keepout zone - The area on or near a FC-PGA/FC-PGA2 packaged processor that system 
designs can not utilize.

•

Keep-in zone - The area of a FC-PGA packaged processor that thermal solutions may utilize.

Additional terms referred to in this and other related documentation:

•

SC242—242-contact slot connector. A processor in the S.E.P. Package uses this connector to 
interface with a system board.

•

370-pin socket (PGA370)—The zero insertion force (ZIF) socket in which a processor in the 
PPGA package will use to interface with a system board.

•

Retention mechanism—A mechanical assembly which holds the package in the SC242 
connector.