Intel 1.00 GHz BX80530F1000256 Datenbogen

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1. Capacitors and resistors may be placed on the pin-side of the FC-PGA package in the area defined by G1, 

G2, and G3. This area is a keepout zone for motherboard designers.

The bare processor die has mechanical load limits that should not be exceeded during heatsink 
assembly, mechanical stress testing, or standard drop and shipping conditions. The heatsink attach 
solution must not induce permanent stress into the processor substrate with the exception of a 
uniform load to maintain the heatsink to the processor thermal interface. The package dynamic and 
static loading parameters are listed in 

For 

, the following apply:

1. It is not recommended to use any portion of the processor substrate as a mechanical reference 

or load bearing surface for thermal solutions.

2. Parameters assume uniformly applied loads

1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and 

processor interface.

A1

0.787

0.889

0.031

0.035

A2

1.000

1.200

0.039

0.047

B1

11.183

11.285

0.440

0.445

B2

9.225

9.327

0.363

0.368

C1

23.495 max

0.925 max

C2

21.590 max

0.850 max

D 49.428

49.632

1.946

1.954

D1 45.466

45.947

1.790

1.810

G1 0.000

17.780

1

0.000

0.700

G2

0.000

17.780

1

0.000

0.700

G3

0.000

0.889

1

0.000

0.035

H

2.540

Nominal

0.100

Nominal

L

3.048

3.302

0.120

0.130

ϕ

P

0.431

0.483

0.017

0.019

Pin TP

0.508 Diametric True Position (Pin-to-Pin)

0.020 Diametric True Position (Pin-to-Pin)

Silicon Die Surface

200

50

lbf

Silicon Die Edge

100

12

lbf