Intel Xeon X3440 BX80605X3440 Benutzerhandbuch

Produktcode

BX80605X3440

Thermal/Mechanical Specifications and Design Guidelines

B-3

Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top) ............................... 82

B-4

Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom) ...................... 83

B-5

1U Collaboration Heatsink Assembly....................................................................... 84

B-6

1U Collaboration Heatsink ..................................................................................... 85

B-7

1U Collaboration Heatsink Screw............................................................................ 86

B-8

Heatsink Compression Spring ................................................................................ 87

B-9

Heatsink Load Cup ............................................................................................... 88

B-10

Heatsink Retaining Ring........................................................................................ 89

B-11

Heatsink Backplate Assembly ................................................................................ 90

B-12

Heatsink Backplate .............................................................................................. 91

B-13

Heatsink Backplate Insulator ................................................................................. 92

B-14

Heatsink Backplate Stud ....................................................................................... 93

B-15

Thermocouple Attach Drawing ............................................................................... 94

B-16

1U ILM Shoulder Screw ........................................................................................ 95

B-17

1U ILM Standard 6-32 Thread Fastener................................................................... 96

C-1

Socket Mechanical Drawing (Sheet 1 of 4)............................................................... 98

C-2

Socket Mechanical Drawing (Sheet 2 of 4)............................................................... 99

C-3

Socket Mechanical Drawing (Sheet 3 of 4)............................................................. 100

C-4

Socket Mechanical Drawing (Sheet 4 of 4)............................................................. 101

D-1

Processor Package Drawing (Sheet 1 of 2) ............................................................ 104

D-2

Processor Package Drawing (Sheet 2 of 2) ............................................................ 105

Tables

1-1

Reference Documents.............................................................................................7

1-2

Terms and Descriptions ..........................................................................................8

2-1

Processor Loading Specifications ............................................................................ 13

2-2

Package Handling Guidelines ................................................................................. 13

2-3

Processor Materials .............................................................................................. 14

2-4

Storage Conditions............................................................................................... 16

5-1

Socket Component Mass ....................................................................................... 33

5-2

1156-land Package and LGA1156 Socket Stackup Height .......................................... 33

5-3

Socket & ILM Mechanical Specifications................................................................... 34

5-4

Electrical Requirements for LGA1156 Socket............................................................ 35

6-1

Intel

Xeon

Processor 3400 Series Thermal Specifications ...................................... 38

6-2

Thermal Test Vehicle Thermal Profile for Intel

Xeon

Processor 3400 Series (95W) .... 40

6-3

Thermal Test Vehicle Thermal Profile for Intel

Xeon

Processor 3400 Series (45W) .... 41

6-4

Thermal Solution Performance above TCONTROL for the Intel

Xeon

Processor 3400 Series (95W) ................................................................................ 42

6-5

Thermal Solution Performance above TCONTROL for the Intel

Xeon

Processor 3400 Series (45W) ................................................................................ 43

6-6

Supported PECI Command Functions and Codes ...................................................... 49

6-7

Error Codes and Descriptions................................................................................. 50

8-1

Boundary Conditions and Performance Targets ........................................................ 59

8-2

Comparison between TTV Thermal Profile and Thermal Solution Performance

for Intel

Xeon

Processor 3400 Series (95W) ........................................................ 61

9-1

Use Conditions (Board Level)................................................................................. 65

10-1

Fan Heatsink Power and Signal Specifications .......................................................... 73

10-2

Fan Heatsink Set Points ........................................................................................ 75

A-1

Collaboration Heatsink Enabled Components ........................................................... 77

A-2

LGA1156 Socket and ILM Components.................................................................... 77

A-3

Supplier Contact Information................................................................................. 77

B-1

Mechanical Drawing List........................................................................................ 79

C-1

Mechanical Drawing List........................................................................................ 97

D-1

Mechanical Drawing List...................................................................................... 103