Benutzerhandbuch für Hayes Microcomputer Products RCV56HCF

Inhaltsverzeichnis

• 1. INTRODUCTION

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• 1.1 SUMMARY

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• 1.2 FEATURES

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• 1.3 TECHNICAL OVERVIEW

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• 1.3.1 General Description

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• 1.3.2 Operating Modes

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• Data/Fax Modes

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• AudioSpan Modes

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• Host-Controlled DSVD Mode (ISDN and SP Models)

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• Voice/Audio Mode (V Models)

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• Speakerphone Mode (ISDN and SP Models)

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• Synchronous Access Mode (SAM)

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• 1.3.3 Host-Controlled Modem Software

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• 1.3.4 Downloadable Modem Data Pump Firmware

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• 2. TECHNICAL SPECIFICATIONS

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• 2.1 ESTABLISHING DATA MODEM CONNECTIONS

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• Dialing

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• Modem Handshaking Protocol

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• Call Progress Tone Detection

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• Answer Tone Detection

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• Ring Detection

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• Billing Protection

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• Connection Speeds

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• Automode

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• 2.2 DATA MODE

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• Speed Buffering (Normal Mode)

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• DTE-to-Modem Flow Control

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• Escape Sequence Detection

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• GSTN Cleardown (K56flex, V.34, V.32 bis, V.32)

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• Fall Forward/Fallback (K56flex, V.34/V.32 bis/V.32)

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• Retrain

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• 2.3 ERROR CORRECTION AND DATA COMPRESSION

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• V.42 bis Data Compression

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• MNP 5 Data Compression

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• 2.4 MNP 10EC™ ENHANCED CELLULAR CONNECTION

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• 2.5 FAX CLASS 1 OPERATION

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• 2.6.1 Online Voice Command Mode

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• 2.6.2 Voice Receive Mode

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• 2.6.3 Voice Transmit Mode

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• 2.6.4 Tone Detectors

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• 2.6.5 Speakerphone Modes

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• 2.7 SIMULTANEOUS AUDIO/VOICE AND DATA (AUDIOSPAN)

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• 2.8 HOST-BASED DSVD MODE

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• 2.9 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE

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• 2.10 VOICEVIEW

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• 2.11 CALLER ID

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• 2.12 WORLD CLASS COUNTRY SUPPORT

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• 2.12.1 Programmable Parameters

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• 2.12.2 Blacklist Parameters

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• 2.13 DIAGNOSTICS

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• 2.13.2 Power On Reset Tests

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• 2.14 LOW POWER SLEEP MODE

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• 3. HARDWARE INTERFACE

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• 3.1 HARDWARE SIGNAL PINS AND DEFINITIONS

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• 3.2 ELECTRICAL,SWITCHING,AND ENVIRONMENTAL CHARACTERISTICS

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• 3.2.1 Power and Maximum Ratings

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• 3.2.2 PCI Bus

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• 3.3 INTERFACE TIMING AND WAVEFORMS

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• 3.3.1 PCI Bus Timing

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• 3.3.2 Serial EEPROM Timing

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• 3.3.3 External Device Bus Timing

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• 3.3.4 IOM-2 Interface

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• 4. DESIGN CONSIDERATIONS

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• 4.1 PC BOARD LAYOUT GUIDELINES

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• 4.1.1 General Principles

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• 4.1.2 Component Placement

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• 4.1.3 Signal Routing

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• 4.1.4 Power

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• 4.1.5 Ground Planes

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• 4.1.7 VC_L1 and VREF Circuit

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• 4.1.8 Telephone and Local Handset Interface

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• 4.1.9 Optional Configurations

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• 4.1.10 MDP Specific

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• 4.2 CRYSTAL/OSCILLATOR SPECIFICATIONS

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• 4.3 OTHER CONSIDERATIONS

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• 4.4 PACKAGE DIMENSIONS

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• 5. SOFTWARE INTERFACE

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• 5.1 PCI CONFIGURATION REGISTERS

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• 5.1.1 Vendor ID Field

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• 5.1.2 Device ID Field

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• 5.1.5 Revision ID Field

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• 5.1.6 Class Code Field

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• 5.1.7 Latency Timer Register

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• 5.1.8 Header Type Field

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• 5.1.9 CIS Pointer Register

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• 5.1.10 Subsystem Vendor ID and Subsystem ID Registers

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• 5.1.11 Interrupt Line Register

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• 5.1.12 Interrupt Pin Register

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• 5.1.13 Min Grant and Max Latency Registers

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• 5.2 BASE ADDRESS REGISTER

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• 5.3 SERIAL EEPROM INTERFACE

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• 6. COMMAND SET

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• Figure 1-1. RCV56HCF System Overview

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• Figure 1-2. RCV56HCF Hardware Configuration Block Diagram

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• Figure 1-3. Typical Audio Signal Interface (U.S.)

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• Figure 3-1. RCV56HCF Interface Signals

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• Figure 3-2. Bus Interface 176-Pin TQFP Hardware Interface Signals

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• Figure 3-3. Bus Interface 176-Pin TQFP Pin Signals

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• Figure 3-4. MDP 144-Pin TQFP Hardware Interface Signals

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• Figure 3-5. MDP 144-Pin TQFP Pin Signals

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• Figure 3-6. Waveforms - Serial EEPROM Interface

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• Figure 3-8. Waveforms - IOM-2 Interface

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• Figure 4-1. Package Dimensions - 144-Pin TQFP

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• Figure 4-2. Package Dimensions - 176-Pin TQFP

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• Table 1-1. Modem Models and Functions

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• Table 1-2. Typical Signal Routing - Voice Mode

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• Table 1-3. Relay Positions - VoiceView Mode

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• Table 3-1. Bus Interface 176-Pin TQFP Pin Signals

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• Table 3-2. Bus Interface Pin Signal Definitions

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• Table 3-3. MDP Pin Signals - 144-Pin TQFP

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• Table 3-4. MDP Pin Signal Definitions

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• Table 3-5. Current and Power Requirements

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• Table 3-6. Maximum Ratings

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• Table 3-7. PCI Bus DC Specifications for 3.3V Signaling

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• Table 3-8. PCI Bus AC Specifications for 3.3V Signaling

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• Table 3-9. MDP Digital Electrical Characteristics

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• Table 3-10. Analog Electrical Characteristics

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• Table 3-11. Timing - Serial EEPROM Interface

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• Table 3-13. Timing - IOM-2 Interface

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• Table 4-1. Modem Pin Noise Characteristics

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• Table 4-2. Crystal Specifications - Surface Mount

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• Table 4-3. Crystal Specifications - Through Hole

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• Table 5-1. PCI Configuration Registers

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• Table 5-2. Command Register

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• Table 5-3. Status Register

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• Table 5-4. BIF Address Map

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• Table 5-5. EEPROM Configuration Data

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• Table 6-1. Command Set Summary - Functional Use Sort

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