Datenbogen (HH80547PE0831MN)Inhaltsverzeichnis1 Introduction91.1 Terminology101.1.1 Processor Packaging Terminology101.2 References112 Electrical Specifications132.1 Power and Ground Pins132.2 Decoupling Guidelines132.2.1 VCC Decoupling132.2.2 FSB GTL+ Decoupling132.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking142.3 Voltage Identification142.3.1 Phase Lock Loop (PLL) Power and Filter162.4 Reserved, Unused, and TESTHI Pins172.5 FSB Signal Groups182.6 Asynchronous GTL+ Signals192.7 Test Access Port (TAP) Connection192.8 FSB Frequency Select Signals (BSEL[1:0])202.9 Absolute Maximum and Minimum Ratings212.10 Processor DC Specifications212.11 VCC Overshoot Specification292.11.1 Die Voltage Validation303 Package Mechanical Specifications313.1 Package Mechanical Specifications313.1.1 Package Mechanical Drawing323.1.2 Processor Component Keep-out Zones353.1.3 Package Loading Specifications353.1.4 Package Handling Guidelines353.1.5 Package Insertion Specifications363.1.6 Processor Mass Specification363.1.7 Processor Materials363.1.8 Processor Markings363.1.9 Processor Pinout Coordinates374 Pin List and Signal Description394.1 Processor Pin Assignments394.2 Alphabetical Signals Reference545 Thermal Specifications and Design Considerations635.1 Processor Thermal Specifications635.1.1 Thermal Specifications635.1.2 Thermal Metrology665.2 Processor Thermal Features675.2.1 Thermal Monitor675.2.2 On-Demand Mode685.2.3 PROCHOT# Signal Pin685.2.4 THERMTRIP# Signal Pin695.2.5 Tcontrol and Fan Speed Reduction695.2.6 Thermal Diode696 Features716.1 Power-On Configuration Options716.2 Clock Control and Low Power States726.2.1 Normal State-State 1726.2.2 AutoHALT Powerdown State-State 2726.2.3 Stop-Grant State-State 3736.2.4 HALT/Grant Snoop State-State 4736.2.5 Sleep State-State 5747 Boxed Processor Specifications757.1 Mechanical Specifications767.1.1 Boxed Processor Cooling Solution Dimensions767.1.2 Boxed Processor Fan Heatsink Weight777.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly787.2 Electrical Requirements787.2.1 Fan Heatsink Power Supply787.3 Thermal Specifications797.3.1 Boxed Processor Cooling Requirements797.3.2 Variable Speed Fan81Größe: 1,8 MBSeiten: 81Language: EnglishHandbuch öffnen