Benutzerhandbuch (BX80547PG3400EK)InhaltsverzeichnisContents3Revision History7Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/52191 Introduction111.1 Terminology121.1.1 Processor Packaging Terminology121.2 References132 Electrical Specifications152.1 FSB and GTLREF152.2 Power and Ground Lands152.3 Decoupling Guidelines152.3.1 VCC Decoupling162.3.2 FSB GTL+ Decoupling162.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking162.4 Voltage Identification172.4.1 Phase Lock Loop (PLL) Power and Filter192.5 Reserved, Unused, FC and TESTHI Signals202.6 FSB Signal Groups212.7 GTL+ Asynchronous Signals222.8 Test Access Port (TAP) Connection232.9 FSB Frequency Select Signals (BSEL[2:0])232.10 Absolute Maximum and Minimum Ratings242.11 Processor DC Specifications242.12 VCC Overshoot Specification332.12.1 Die Voltage Validation332.13 GTL+ FSB Specifications343 Package Mechanical Specifications353.1 Package Mechanical Drawing353.2 Processor Component Keep-Out Zones393.3 Package Loading Specifications393.4 Package Handling Guidelines393.5 Package Insertion Specifications403.6 Processor Mass Specification403.7 Processor Materials403.8 Processor Markings403.9 Processor Land Coordinates414 Land Listing and Signal Descriptions434.1 Processor Land Assignments434.2 Alphabetical Signals Reference665 Thermal Specifications and Design Considerations755.1 Processor Thermal Specifications755.1.1 Thermal Specifications755.1.2 Thermal Metrology795.2 Processor Thermal Features795.2.1 Thermal Monitor795.2.2 Thermal Monitor 2805.2.3 On-Demand Mode815.2.4 PROCHOT# Signal825.2.5 THERMTRIP# Signal825.2.6 TCONTROL and Fan Speed Reduction825.2.7 Thermal Diode836 Features856.1 Power-On Configuration Options856.2 Clock Control and Low Power States856.2.1 Normal State866.2.2 HALT and Enhanced HALT Powerdown States866.2.2.1 HALT Powerdown State866.2.2.2 Enhanced HALT Powerdown State866.2.3 Stop-Grant State876.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State886.2.4.1 HALT Snoop State, Grant Snoop State886.2.4.2 Enhanced HALT Snoop State887 Boxed Processor Specifications897.1 Mechanical Specifications907.1.1 Boxed Processor Cooling Solution Dimensions907.1.2 Boxed Processor Fan Heatsink Weight917.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly917.2 Electrical Requirements917.2.1 Fan Heatsink Power Supply917.3 Thermal Specifications937.3.1 Boxed Processor Cooling Requirements937.3.2 Variable Speed Fan95Größe: 1,55 MBSeiten: 96Language: EnglishHandbuch öffnen
Datenbogen (HH80547PG0961MM)InhaltsverzeichnisContents3Figures5Tables6Intel® Pentium® Dual-Core Desktop Processor E2000D Series7Revision History8Intel® Pentium® Dual-Core Desktop Processor E2000D Series11 Introduction91.1 Terminology91.1.1 Processor Terminology101.2 References112 Electrical Specifications132.1 Power and Ground Lands132.2 Decoupling Guidelines132.2.1 VCC Decoupling132.2.2 VTT Decoupling132.2.3 FSB Decoupling142.3 Voltage Identification142.4 Market Segment Identification (MSID)162.5 Reserved, Unused, and TESTHI Signals162.6 Voltage and Current Specification172.6.1 Absolute Maximum and Minimum Ratings172.6.2 DC Voltage and Current Specification192.6.3 Vcc Overshoot212.6.4 Die Voltage Validation222.7 Signaling Specifications222.7.1 FSB Signal Groups232.7.2 CMOS and Open Drain Signals242.7.3 Processor DC Specifications252.7.3.1 GTL+ Front Side Bus Specifications262.8 Clock Specifications282.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking282.8.2 FSB Frequency Select Signals (BSEL[2:0])282.8.3 Phase Lock Loop (PLL) and Filter292.8.4 BCLK[1:0] Specifications (CK505 based Platforms)292.8.5 BCLK[1:0] Specifications (CK410 based Platforms)312.9 PECI DC Specifications323 Package Mechanical Specifications333.1 Package Mechanical Drawing333.2 Processor Component Keep-Out Zones373.3 Package Loading Specifications373.4 Package Handling Guidelines373.5 Package Insertion Specifications383.6 Processor Mass Specification383.7 Processor Materials383.8 Processor Markings383.9 Processor Land Coordinates394 Land Listing and Signal Descriptions414.1 Processor Land Assignments414.2 Alphabetical Signals Reference645 Thermal Specifications and Design Considerations735.1 Processor Thermal Specifications735.1.1 Thermal Specifications735.1.2 Thermal Metrology775.2 Processor Thermal Features775.2.1 Thermal Monitor775.2.2 Thermal Monitor 2785.2.3 On-Demand Mode795.2.4 PROCHOT# Signal805.2.5 THERMTRIP# Signal805.3 Thermal Diode815.4 Platform Environment Control Interface (PECI)835.4.1 Introduction835.4.1.1 Key Difference with Legacy Diode-Based Thermal Management835.4.2 PECI Specifications855.4.2.1 PECI Device Address855.4.2.2 PECI Command Support855.4.2.3 PECI Fault Handling Requirements855.4.2.4 PECI GetTemp0() Error Code Support856 Features876.1 Power-On Configuration Options876.2 Clock Control and Low Power States886.2.1 Normal State886.2.2 HALT and Extended HALT Powerdown States886.2.2.1 HALT Powerdown State896.2.2.2 Extended HALT Powerdown State896.2.3 Stop Grant and Extended Stop Grant States896.2.3.1 Stop-Grant State906.2.3.2 Extended Stop Grant State906.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State906.2.4.1 HALT Snoop State, Stop Grant Snoop State906.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State916.3 Enhanced Intel SpeedStep® Technology917 Boxed Processor Specifications937.1 Mechanical Specifications947.1.1 Boxed Processor Cooling Solution Dimensions947.1.2 Boxed Processor Fan Heatsink Weight967.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly967.2 Electrical Requirements967.2.1 Fan Heatsink Power Supply967.3 Thermal Specifications987.3.1 Boxed Processor Cooling Requirements987.3.2 Fan Speed Control Operation (Intel® Pentium® Dual-Core Desktop Processor E2000 Series)1008 Debug Tools Specifications1038.1 Logic Analyzer Interface (LAI)1038.1.1 Mechanical Considerations1038.1.2 Electrical Considerations103Größe: 1,36 MBSeiten: 104Language: EnglishHandbuch öffnen
