BenutzerhandbuchInhaltsverzeichnis1 Overview111.1 Introduction111.1.1 Processor Feature Details141.1.2 Supported Technologies141.2 Interfaces141.2.1 System Memory Support141.2.2 PCI Express*161.2.3 Direct Media Interface Gen 2 (DMI2)171.2.4 Intel® QuickPath Interconnect (Intel® QPI)181.2.5 Platform Environment Control Interface (PECI)181.3 Power Management Support191.3.1 Processor Package and Core States191.3.2 System States Support191.3.3 Memory Controller191.3.4 PCI Express*191.3.5 Intel® QPI191.4 Thermal Management Support191.5 Package Summary191.6 Terminology201.7 Related Documents221.8 Statement of Volatility (SOV)231.9 State of Data232 Interfaces252.1 System Memory Interface252.1.1 System Memory Technology Support252.1.2 System Memory Timing Support252.2 PCI Express* Interface262.2.1 PCI Express* Architecture262.2.2 PCI Express* Configuration Mechanism272.3 DMI2/PCI Express* Interface282.3.1 DMI2 Error Flow282.3.2 Processor/PCH Compatibility Assumptions282.3.3 DMI2 Link Down282.4 Intel® QuickPath Interconnect (Intel® QPI)282.5 Platform Environment Control Interface (PECI)292.5.1 PECI Client Capabilities302.5.2 Client Command Suite312.5.3 Client Management682.5.4 Multi-Domain Commands732.5.5 Client Responses742.5.6 Originator Responses752.5.7 DTS Temperature Data753 Technologies773.1 Intel® Virtualization Technology (Intel® VT)773.1.1 Intel® VT-x Objectives773.1.2 Intel® VT-x Features783.1.3 Intel® VT-d Objectives783.1.4 Intel® Virtualization Technology Processor Extensions793.2 Security Technologies793.2.1 Intel® Trusted Execution Technology793.2.2 Intel® Trusted Execution Technology – Server Extensions803.2.3 AES Instructions803.2.4 Execute Disable Bit813.3 Intel® Secure Key813.4 Intel® OS Guard813.5 Intel® Hyper-Threading Technology813.6 Intel® Turbo Boost Technology823.6.1 Intel® Turbo Boost Operating Frequency823.7 Enhanced Intel SpeedStep® Technology823.8 Intel® Intelligent Power Technology833.9 Intel® Advanced Vector Extensions (Intel® AVX)833.10 Intel® Dynamic Power Technology844 Power Management854.1 ACPI States Supported854.1.1 System States854.1.2 Processor Package and Core States854.1.3 Integrated Memory Controller States864.1.4 DMI2/PCI Express* Link States874.1.5 Intel® QuickPath Interconnect States874.1.6 G, S, and C State Combinations874.2 Processor Core/Package Power Management884.2.1 Enhanced Intel SpeedStep® Technology884.2.2 Low-Power Idle States884.2.3 Requesting Low-Power Idle States894.2.4 Core C-states904.2.5 Package C-States914.2.6 Package C-State Power Specifications954.2.7 Processor Package Power Specifications954.3 System Memory Power Management964.3.1 CKE Power-Down964.3.2 Self Refresh974.3.3 DRAM I/O Power Management974.4 DMI2/PCI Express* Power Management985 Thermal Management Specifications995.1 Package Thermal Specifications995.1.1 Thermal Specifications995.1.2 TCASE and DTS Based Thermal Specifications1015.1.3 Processor Operational Thermal Specifications1025.1.4 Embedded Server Thermal Profiles1065.1.5 Thermal Metrology1095.2 Processor Core Thermal Features1105.2.1 Processor Temperature1105.2.2 Adaptive Thermal Monitor1105.2.3 On-Demand Mode1125.2.4 PROCHOT_N Signal1135.2.5 THERMTRIP_N Signal1135.2.6 Integrated Memory Controller (IMC) Thermal Features1146 Signal Descriptions1176.1 System Memory Interface Signals1176.2 PCI Express* Based Interface Signals1186.3 DMI2/PCI Express* Port 0 Signals1206.4 Intel® QuickPath Interconnect Signals1206.5 PECI Signal1216.6 System Reference Clock Signals1216.7 JTAG and TAP Signals1216.8 Serial VID Interface (SVID) Signals1226.9 Processor Asynchronous Sideband and Miscellaneous Signals1226.10 Processor Power and Ground Supplies1257 Electrical Specifications1277.1 Processor Signaling1277.1.1 System Memory Interface Signal Groups1277.1.2 PCI Express Signals1277.1.3 DMI2/PCI Express Signals1277.1.4 Intel® QuickPath Interconnect1277.1.5 Platform Environmental Control Interface (PECI)1287.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)1287.1.7 JTAG and Test Access Port (TAP) Signals1297.1.8 Processor Sideband Signals1297.1.9 Power, Ground and Sense Signals1297.1.10 Reserved or Unused Signals1347.2 Signal Group Summary1347.3 Power-On Configuration (POC) Options1387.4 Fault Resilient Booting (FRB)1387.5 Mixing Processors1397.6 Flexible Motherboard Guidelines (FMB)1407.7 Absolute Maximum and Minimum Ratings1407.7.1 Storage Condition Specifications1407.8 DC Specifications1417.8.1 Voltage and Current Specifications1417.8.2 Die Voltage Validation1467.8.3 Signal DC Specifications1477.9 Signal Quality1547.9.1 DDR3 Signal Quality Specifications1547.9.2 I/O Signal Quality Specifications1547.9.3 Intel® QuickPath Interconnect Signal Quality Specifications1547.9.4 Input Reference Clock Signal Quality Specifications1547.9.5 Overshoot/Undershoot Tolerance1558 Processor Land Listing1598.1 Listing by Land Name1598.2 Listing by Land Number1839 Package Mechanical Specifications2099.1 Package Size and SKUs2099.2 Package Mechanical Drawing (PMD)2109.3 Processor Component Keep-Out Zones2159.4 Package Loading Specifications2159.5 Package Handling Guidelines2159.6 Package Insertion Specifications2159.7 Processor Mass Specification2169.8 Processor Materials2169.9 Processor Markings21610 Boxed Processor Specifications21710.1 Introduction21710.1.1 Available Boxed Thermal Solution Configurations21710.1.2 Intel Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)21710.1.3 Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)21810.2 Mechanical Specifications21910.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones21910.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS)22810.3 Fan Power Supply [STS200C]22810.3.1 Boxed Processor Cooling Requirements22910.4 Boxed Processor Contents232Größe: 2,31 MBSeiten: 232Language: EnglishHandbuch öffnen
BenutzerhandbuchInhaltsverzeichnis1 Overview111.1 Introduction111.1.1 Processor Feature Details141.1.2 Supported Technologies141.2 Interfaces141.2.1 System Memory Support141.2.2 PCI Express*161.2.3 Direct Media Interface Gen 2 (DMI2)171.2.4 Intel® QuickPath Interconnect (Intel® QPI)181.2.5 Platform Environment Control Interface (PECI)181.3 Power Management Support191.3.1 Processor Package and Core States191.3.2 System States Support191.3.3 Memory Controller191.3.4 PCI Express*191.3.5 Intel® QPI191.4 Thermal Management Support191.5 Package Summary191.6 Terminology201.7 Related Documents221.8 Statement of Volatility (SOV)231.9 State of Data232 Interfaces252.1 System Memory Interface252.1.1 System Memory Technology Support252.1.2 System Memory Timing Support252.2 PCI Express* Interface262.2.1 PCI Express* Architecture262.2.2 PCI Express* Configuration Mechanism272.3 DMI2/PCI Express* Interface282.3.1 DMI2 Error Flow282.3.2 Processor/PCH Compatibility Assumptions282.3.3 DMI2 Link Down282.4 Intel® QuickPath Interconnect (Intel® QPI)282.5 Platform Environment Control Interface (PECI)292.5.1 PECI Client Capabilities302.5.2 Client Command Suite312.5.3 Client Management682.5.4 Multi-Domain Commands732.5.5 Client Responses742.5.6 Originator Responses752.5.7 DTS Temperature Data753 Technologies773.1 Intel® Virtualization Technology (Intel® VT)773.1.1 Intel® VT-x Objectives773.1.2 Intel® VT-x Features783.1.3 Intel® VT-d Objectives783.1.4 Intel® Virtualization Technology Processor Extensions793.2 Security Technologies793.2.1 Intel® Trusted Execution Technology793.2.2 Intel® Trusted Execution Technology – Server Extensions803.2.3 AES Instructions803.2.4 Execute Disable Bit813.3 Intel® Secure Key813.4 Intel® OS Guard813.5 Intel® Hyper-Threading Technology813.6 Intel® Turbo Boost Technology823.6.1 Intel® Turbo Boost Operating Frequency823.7 Enhanced Intel SpeedStep® Technology823.8 Intel® Intelligent Power Technology833.9 Intel® Advanced Vector Extensions (Intel® AVX)833.10 Intel® Dynamic Power Technology844 Power Management854.1 ACPI States Supported854.1.1 System States854.1.2 Processor Package and Core States854.1.3 Integrated Memory Controller States864.1.4 DMI2/PCI Express* Link States874.1.5 Intel® QuickPath Interconnect States874.1.6 G, S, and C State Combinations874.2 Processor Core/Package Power Management884.2.1 Enhanced Intel SpeedStep® Technology884.2.2 Low-Power Idle States884.2.3 Requesting Low-Power Idle States894.2.4 Core C-states904.2.5 Package C-States914.2.6 Package C-State Power Specifications954.2.7 Processor Package Power Specifications954.3 System Memory Power Management964.3.1 CKE Power-Down964.3.2 Self Refresh974.3.3 DRAM I/O Power Management974.4 DMI2/PCI Express* Power Management985 Thermal Management Specifications995.1 Package Thermal Specifications995.1.1 Thermal Specifications995.1.2 TCASE and DTS Based Thermal Specifications1015.1.3 Processor Operational Thermal Specifications1025.1.4 Embedded Server Thermal Profiles1065.1.5 Thermal Metrology1095.2 Processor Core Thermal Features1105.2.1 Processor Temperature1105.2.2 Adaptive Thermal Monitor1105.2.3 On-Demand Mode1125.2.4 PROCHOT_N Signal1135.2.5 THERMTRIP_N Signal1135.2.6 Integrated Memory Controller (IMC) Thermal Features1146 Signal Descriptions1176.1 System Memory Interface Signals1176.2 PCI Express* Based Interface Signals1186.3 DMI2/PCI Express* Port 0 Signals1206.4 Intel® QuickPath Interconnect Signals1206.5 PECI Signal1216.6 System Reference Clock Signals1216.7 JTAG and TAP Signals1216.8 Serial VID Interface (SVID) Signals1226.9 Processor Asynchronous Sideband and Miscellaneous Signals1226.10 Processor Power and Ground Supplies1257 Electrical Specifications1277.1 Processor Signaling1277.1.1 System Memory Interface Signal Groups1277.1.2 PCI Express Signals1277.1.3 DMI2/PCI Express Signals1277.1.4 Intel® QuickPath Interconnect1277.1.5 Platform Environmental Control Interface (PECI)1287.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)1287.1.7 JTAG and Test Access Port (TAP) Signals1297.1.8 Processor Sideband Signals1297.1.9 Power, Ground and Sense Signals1297.1.10 Reserved or Unused Signals1347.2 Signal Group Summary1347.3 Power-On Configuration (POC) Options1387.4 Fault Resilient Booting (FRB)1387.5 Mixing Processors1397.6 Flexible Motherboard Guidelines (FMB)1407.7 Absolute Maximum and Minimum Ratings1407.7.1 Storage Condition Specifications1407.8 DC Specifications1417.8.1 Voltage and Current Specifications1417.8.2 Die Voltage Validation1467.8.3 Signal DC Specifications1477.9 Signal Quality1547.9.1 DDR3 Signal Quality Specifications1547.9.2 I/O Signal Quality Specifications1547.9.3 Intel® QuickPath Interconnect Signal Quality Specifications1547.9.4 Input Reference Clock Signal Quality Specifications1547.9.5 Overshoot/Undershoot Tolerance1558 Processor Land Listing1598.1 Listing by Land Name1598.2 Listing by Land Number1839 Package Mechanical Specifications2099.1 Package Size and SKUs2099.2 Package Mechanical Drawing (PMD)2109.3 Processor Component Keep-Out Zones2159.4 Package Loading Specifications2159.5 Package Handling Guidelines2159.6 Package Insertion Specifications2159.7 Processor Mass Specification2169.8 Processor Materials2169.9 Processor Markings21610 Boxed Processor Specifications21710.1 Introduction21710.1.1 Available Boxed Thermal Solution Configurations21710.1.2 Intel Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)21710.1.3 Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)21810.2 Mechanical Specifications21910.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones21910.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS)22810.3 Fan Power Supply [STS200C]22810.3.1 Boxed Processor Cooling Requirements22910.4 Boxed Processor Contents232Größe: 2,31 MBSeiten: 232Language: EnglishHandbuch öffnen
