BenutzerhandbuchInhaltsverzeichnis1 Introduction91.1 References101.2 Definition of Terms102 Package Mechanical & Storage Specifications132.1 Package Mechanical Specifications132.1.1 Package Mechanical Drawing142.1.2 Processor Component Keep-Out Zones142.1.3 Package Loading Specifications152.1.4 Package Handling Guidelines152.1.5 Package Insertion Specifications152.1.6 Processor Mass Specification152.1.7 Processor Materials162.1.8 Processor Markings162.1.9 Processor Land Coordinates172.2 Processor Storage Specifications183 LGA1155 Socket193.1 Board Layout203.1.1 Suggested Silkscreen Marking for Socket Identification223.2 Attachment to Motherboard223.3 Socket Components233.3.1 Socket Body Housing233.3.2 Solder Balls233.3.3 Contacts233.3.4 Pick and Place Cover233.4 Package Installation / Removal243.4.1 Socket Standoffs and Package Seating Plane253.5 Durability253.6 Markings253.7 Component Insertion Forces263.8 Socket Size264 Independent Loading Mechanism (ILM)274.1 Design Concept274.1.1 ILM Assembly Design Overview274.1.2 ILM Back Plate Design Overview284.1.3 Shoulder Screw and Fasteners Design Overview294.2 Assembly of ILM to a Motherboard304.3 ILM Interchangeability324.4 Markings324.5 ILM Cover335 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications375.1 Component Mass375.2 Package/Socket Stackup Height375.3 Loading Specifications385.4 Electrical Requirements385.5 Environmental Requirements396 Thermal Specifications416.1 Thermal Specifications416.1.1 Intel® Xeon® Processor E3-1280 (95W)Thermal Profile436.1.2 Intel® Xeon® Processor E3-1200 (80W) Thermal Profile446.1.3 Intel® Xeon® Processor E3-1260L (45W) Thermal Profile466.1.4 Intel® Xeon® Processor E3-1220L (20W) Thermal Profile476.1.5 Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics Thermal Profile486.1.6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL496.1.7 Thermal Metrology546.2 Processor Thermal Features546.2.1 Processor Temperature546.2.2 Adaptive Thermal Monitor546.2.3 THERMTRIP# Signal586.3 Intel® Turbo Boost Technology586.3.1 Intel® Turbo Boost Technology Frequency586.3.2 Intel® Turbo Boost Technology Graphics Frequency596.4 Thermal Considerations596.4.1 Intel® Turbo Boost Technology Power Control and Reporting606.4.2 Package Power Control616.4.3 Power Plane Control616.4.4 Turbo Time Parameter617 PECI Interface637.1 Platform Environment Control Interface (PECI)637.1.1 Introduction638 Sensor Based Thermal Specification Design Guidance658.1 Sensor Based Specification Overview (DTS 1.0)658.2 Sensor Based Thermal Specification678.2.1 TTV Thermal Profile678.2.2 Specification When DTS value is Greater than TCONTROL688.3 Thermal Solution Design Process688.3.1 Boundary Condition Definition688.3.2 Thermal Design and Modelling698.3.3 Thermal Solution Validation698.4 Fan Speed Control (FSC) Design Process698.4.1 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data718.5 System Validation739 1U Thermal Solution759.1 Performance Targets759.2 1U Collaboration Heatsink759.2.1 Heatsink Performance759.2.2 Thermal Solution789.2.3 Assembly799.3 1U Reference Heatsink809.3.1 Heatsink Performance809.3.2 Thermal Solution809.3.3 Assembly819.4 Geometric Envelope for 1U Thermal Mechanical Design819.5 Thermal Interface Material819.6 Heat Pipe Thermal Consideration8110 Active Tower Thermal Solution8310.1 Introduction8310.2 Mechanical Specifications8410.2.1 Cooling Solution Dimensions8410.2.2 Retention Mechanism and Heatsink Attach Clip Assembly8510.3 Electrical Requirements8510.3.1 Active Tower Heatsink Power Supply8510.4 Cooling Requirements8711 Thermal Solution Quality and Reliability Requirements8911.1 Reference Heatsink Thermal Verification8911.2 Mechanical Environmental Testing8911.2.1 Recommended Test Sequence9011.2.2 Post-Test Pass Criteria9011.2.3 Recommended BIOS/Processor/Memory Test Procedures9011.3 Material and Recycling Requirements91A Component Suppliers93B Mechanical Drawings95C Socket Mechanical Drawings115D Package Mechanical Drawings121Größe: 3,6 MBSeiten: 124Language: EnglishHandbuch öffnen
BenutzerhandbuchInhaltsverzeichnis1 Introduction91.1 References101.2 Definition of Terms102 Package Mechanical & Storage Specifications132.1 Package Mechanical Specifications132.1.1 Package Mechanical Drawing142.1.2 Processor Component Keep-Out Zones142.1.3 Package Loading Specifications152.1.4 Package Handling Guidelines152.1.5 Package Insertion Specifications152.1.6 Processor Mass Specification152.1.7 Processor Materials162.1.8 Processor Markings162.1.9 Processor Land Coordinates172.2 Processor Storage Specifications183 LGA1155 Socket193.1 Board Layout203.1.1 Suggested Silkscreen Marking for Socket Identification223.2 Attachment to Motherboard223.3 Socket Components233.3.1 Socket Body Housing233.3.2 Solder Balls233.3.3 Contacts233.3.4 Pick and Place Cover233.4 Package Installation / Removal243.4.1 Socket Standoffs and Package Seating Plane253.5 Durability253.6 Markings253.7 Component Insertion Forces263.8 Socket Size264 Independent Loading Mechanism (ILM)274.1 Design Concept274.1.1 ILM Assembly Design Overview274.1.2 ILM Back Plate Design Overview284.1.3 Shoulder Screw and Fasteners Design Overview294.2 Assembly of ILM to a Motherboard304.3 ILM Interchangeability324.4 Markings324.5 ILM Cover335 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications375.1 Component Mass375.2 Package/Socket Stackup Height375.3 Loading Specifications385.4 Electrical Requirements385.5 Environmental Requirements396 Thermal Specifications416.1 Thermal Specifications416.1.1 Intel® Xeon® Processor E3-1280 (95W)Thermal Profile436.1.2 Intel® Xeon® Processor E3-1200 (80W) Thermal Profile446.1.3 Intel® Xeon® Processor E3-1260L (45W) Thermal Profile466.1.4 Intel® Xeon® Processor E3-1220L (20W) Thermal Profile476.1.5 Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics Thermal Profile486.1.6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL496.1.7 Thermal Metrology546.2 Processor Thermal Features546.2.1 Processor Temperature546.2.2 Adaptive Thermal Monitor546.2.3 THERMTRIP# Signal586.3 Intel® Turbo Boost Technology586.3.1 Intel® Turbo Boost Technology Frequency586.3.2 Intel® Turbo Boost Technology Graphics Frequency596.4 Thermal Considerations596.4.1 Intel® Turbo Boost Technology Power Control and Reporting606.4.2 Package Power Control616.4.3 Power Plane Control616.4.4 Turbo Time Parameter617 PECI Interface637.1 Platform Environment Control Interface (PECI)637.1.1 Introduction638 Sensor Based Thermal Specification Design Guidance658.1 Sensor Based Specification Overview (DTS 1.0)658.2 Sensor Based Thermal Specification678.2.1 TTV Thermal Profile678.2.2 Specification When DTS value is Greater than TCONTROL688.3 Thermal Solution Design Process688.3.1 Boundary Condition Definition688.3.2 Thermal Design and Modelling698.3.3 Thermal Solution Validation698.4 Fan Speed Control (FSC) Design Process698.4.1 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data718.5 System Validation739 1U Thermal Solution759.1 Performance Targets759.2 1U Collaboration Heatsink759.2.1 Heatsink Performance759.2.2 Thermal Solution789.2.3 Assembly799.3 1U Reference Heatsink809.3.1 Heatsink Performance809.3.2 Thermal Solution809.3.3 Assembly819.4 Geometric Envelope for 1U Thermal Mechanical Design819.5 Thermal Interface Material819.6 Heat Pipe Thermal Consideration8110 Active Tower Thermal Solution8310.1 Introduction8310.2 Mechanical Specifications8410.2.1 Cooling Solution Dimensions8410.2.2 Retention Mechanism and Heatsink Attach Clip Assembly8510.3 Electrical Requirements8510.3.1 Active Tower Heatsink Power Supply8510.4 Cooling Requirements8711 Thermal Solution Quality and Reliability Requirements8911.1 Reference Heatsink Thermal Verification8911.2 Mechanical Environmental Testing8911.2.1 Recommended Test Sequence9011.2.2 Post-Test Pass Criteria9011.2.3 Recommended BIOS/Processor/Memory Test Procedures9011.3 Material and Recycling Requirements91A Component Suppliers93B Mechanical Drawings95C Socket Mechanical Drawings115D Package Mechanical Drawings121Größe: 3,6 MBSeiten: 124Language: EnglishHandbuch öffnen
