Benutzerhandbuch für Intel R2000BB4GS9

Inhaltsverzeichnis

• 1. Introduction

  11
  • 1.1 Chapter Outline

    11
  • 1.2 Server Board Use Disclaimer

    11
  • 1.3 Product Errata

    11
• 2. Product Family Overview

  12
  • 2.1 Chassis Dimensions

    14
  • 2.2 System Level Environmental Limits

    15
  • 2.3 System Features and Options Overview

    16
    • 2.3.1 Hot Swap Hard Drive Bay and Front Panel Options

      16
    • 2.3.2 Back Panel Features

      18
    • 2.3.3 Front Control Panel Options

      18
  • 2.4 Server Board Features Overview

    19
  • 2.5 Available Front Bezel Support

    21
  • 2.6 Available Rack and Cabinet Mounting Kit Options

    22
• 3. Power Subsystem

  23
  • 3.1 Mechanical Overview

    23
  • 3.2 Main Power Inter-Connect Layout

    25
  • 3.3 Power Connectors

    25
    • 3.3.1 Power Supply Module Card Edge Connector

      25
    • 3.3.2 Riser Card Power Connectors

      26
    • 3.3.3 Hot Swap Backplane Power Connector

      26
    • 3.3.4 Optical Drive and SSD Power Connector

      27
  • 3.4 Power Supply Module Efficiency

    27
  • 3.5 Power Cord Specification Requirements

    27
  • 3.6 Optional Chassis Grounding Support

    28
  • 3.7 AC Input Requirement

    28
    • 3.7.1 Power Factor

      28
    • 3.7.2 AC Input Voltage Specification

      28
    • 3.7.3 AC Line Isolation Requirements

      29
    • 3.7.4 AC Line Dropout / Holdup

      29
      • 3.7.4.1 AC Line 12VSBHoldup

        29
    • 3.7.5 AC Line Fuse

      29
    • 3.7.6 AC Inrush

      29
    • 3.7.7 AC Line Transient Specification

      29
    • 3.7.8 Susceptibility Requirements

      30
    • 3.7.9 Electrostatic Discharge Susceptibility

      30
    • 3.7.10 Fast Transient/Burst

      30
    • 3.7.11 Radiated Immunity

      30
    • 3.7.12 Surge Immunity

      30
    • 3.7.13 Power Recovery

      31
    • 3.7.14 Voltage Interruptions

      31
    • 3.7.15 Protection Circuits

      31
    • 3.7.16 Over-current Protection (OCP)

      31
    • 3.7.17 Over-voltage Protection (OVP)

      31
    • 3.7.18 Over-temperature Protection (OTP)

      31
  • 3.8 Cold Redundancy Support

    32
    • 3.8.1 Powering on Cold Standby supplies to maintain best efficiency

      32
    • 3.8.2 Powering on Cold Standby supplies during a fault or over current condition

      32
    • 3.8.3 BMC Requirements

      32
    • 3.8.4 Power Supply Turn On Function

      33
  • 3.9 Closed Loop System Throttling (CLST)

    33
  • 3.10 Smart Ride Through Throttling (SmaRT)

    33
  • 3.11 Power Supply Status LED

    33
• 4. Thermal Management

  34
  • 4.1 Thermal Operation and Configuration Requirements

    34
  • 4.2 Thermal Management Overview

    35
    • 4.2.1 Set Throttling Mode

      35
    • 4.2.2 Altitude

      36
    • 4.2.3 Set Fan Profile

      36
    • 4.2.4 Fan PWM Offset

      36
    • 4.2.5 Quiet Fan Idle Mode

      36
    • 4.2.6 Thermal Sensor Input for Fan Speed Control

      36
  • 4.3 System Fans

    37
  • 4.4 Power Supply Module Fan

    39
  • 4.5 FRUSDR Utility

    39
• 5. Intel® Xeon Phi™ Coprocessor and GPGPU Add-in Card Support

  40
  • 5.1 High Power Add-in Card Support Criteria

    40
  • 5.2 Intel® Xeon Phi™ Coprocessor Card – System Configuration Requirements

    41
• 6. System Storage and Peripheral Drive Bays Overview

  42
  • 6.1 2.5” Hard Disk Drive Support

    42
    • 6.1.1 2.5” Drive Hot-Swap Backplane Overview

      44
    • 6.1.2 Cypress* CY8C22545 Enclosure Management Controller

      45
  • 6.2 3.5” Hard Disk Drive Support

    46
    • 6.2.1 3.5” Drive Hot-Swap Backplane Overview

      47
    • 6.2.2 Cypress* CY8C22545 Enclosure Management Controller

      48
  • 6.3 Optical Drive Support

    49
  • 6.4 Internal – Fixed Mount Solid State Drive (SSD) Support

    50
  • 6.5 Low Profile eUSB SSD Support

    51
  • 6.6 SATA DOM Support

    51
  • 6.7 mSATA SSD Support

    52
• 7. Storage Controller Options Overview

  53
  • 7.1 Embedded SATA / SAS Controller support

    53
  • 7.2 Embedded Software RAID Support

    54
    • 7.2.1 Intel® Embedded Server RAID Technology 2 (ESRT2)

      54
    • 7.2.2 Intel® Rapid Storage Technology (RSTe)

      54
  • 7.3 Intel® Integrated RAID Module Support (Available Option)

    55
  • 7.4 Intel® SAS Expander Support Options

    56
    • 7.4.1 24-Port PCIe Intel® RAID Expander Card RES2SV240

      57
    • 7.4.2 24-Port and 36-Port Internal Intel RAID Expander Cards

      57
    • 7.4.3 SAS Expander Usage Guidelines

      59
    • 7.4.4 Sample SAS Expander Configurations

      59
      • 7.4.4.1 Cable Routing using the both embedded SCU ports and a SAS Expander Card (RSTe only)

        60
      • 7.4.4.2 Cable Routing using a x8 wide-port capable 6 Gb SAS / SAS RAID Controller and an expander card

        60
• 8. Front Control Panel and I/O Panel Overview

  61
  • 8.1 I/O Panel Features

    61
  • 8.2 Control Panel Features

    62
• 9. Intel® Local Control Panel

  65
• 10. PCI Riser Card Support

  66
  • 10.1 Architectural Overview of the Server Board Riser Slots

    66
  • 10.2 Riser Card Support

    68
  • 10.3 Riser Card Options – Riser Slot #1

    69
    • 10.3.1 1-Slot PCIe Riser Card (Required for Intel® Xeon Phi™ and GPGPU Support)

      69
    • 10.3.2 3-Slot PCIe Riser Card

      69
  • 10.4 Riser Card Options – Riser Slot #2

    70
    • 10.4.1 2-Slot PCIe Riser Card (Required for Intel® Xeon Phi™ and GPGPU Support)

      70
    • 10.4.2 3-Slot PCIe Riser Card

      70
    • 10.4.3 3-Slot PCIx / PCIe Riser Card

      71
• 11. Mezzanine Module Support

  72
  • 11.1 IO Module Support

    72
  • 11.2 Intel® Remote Management Module 4 (RMM4) Lite and Management NIC Support

    72
• Appendix A: Integration and Usage Tips

  74
• Appendix B: POST Code Diagnostic LED Decoder

  75
• Appendix C: POST Code Errors

  80
• Appendix D: System Configuration Table for Thermal Compatibility

  85
• Glossary

  88
• Reference Documents

  89