Benutzerhandbuch für Lenovo Intel Xeon E5520

Inhaltsverzeichnis

• 1 Introduction

  9
  • 1.1 References

    10
  • 1.2 Definition of Terms

    10
• 2 LGA1366 Socket

  13
  • 2.1 Board Layout

    15
  • 2.2 Attachment to Motherboard

    16
  • 2.3 Socket Components

    16
    • 2.3.1 Socket Body Housing

      16
    • 2.3.2 Solder Balls

      16
    • 2.3.3 Contacts

      17
    • 2.3.4 Pick and Place Cover

      17
  • 2.4 Package Installation / Removal

    18
    • 2.4.1 Socket Standoffs and Package Seating Plane

      18
  • 2.5 Durability

    19
  • 2.6 Markings

    19
  • 2.7 Component Insertion Forces

    19
  • 2.8 Socket Size

    19
  • 2.9 LGA1366 Socket NCTF Solder Joints

    20
• 3 Independent Loading Mechanism (ILM)

  21
  • 3.1 Design Concept

    21
    • 3.1.1 ILM Cover Assembly Design Overview

      21
    • 3.1.2 ILM Back Plate Design Overview

      22
  • 3.2 Assembly of ILM to a Motherboard

    23
• 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

  27
  • 4.1 Component Mass

    27
  • 4.2 Package/Socket Stackup Height

    27
  • 4.3 Socket Maximum Temperature

    27
  • 4.4 Loading Specifications

    28
  • 4.5 Electrical Requirements

    28
  • 4.6 Environmental Requirements

    29
• 5 Thermal Solutions

  31
  • 5.1 Performance Targets

    31
    • 5.1.1 25.5 mm Tall Heatsink

      33
  • 5.2 Heat Pipe Considerations

    34
  • 5.3 Assembly

    35
    • 5.3.1 Thermal Interface Material (TIM)

      36
  • 5.4 Structural Considerations

    36
  • 5.5 Thermal Design

    36
    • 5.5.1 Thermal Characterization Parameter

      36
    • 5.5.2 Dual Thermal Profile

      37
  • 5.6 Thermal Features

    38
    • 5.6.1 Fan Speed Control

      39
    • 5.6.2 PECI Averaging and Catastrophic Thermal Management

      40
    • 5.6.3 Intel® Turbo Boost Technology

      40
  • 5.7 Thermal Guidance

    40
    • 5.7.1 Thermal Excursion Power for 95 W Processor

      40
    • 5.7.2 Thermal Excursion Power for 80 W Processor

      41
    • 5.7.3 Absolute Processor Temperature

      41
• 6 Quality and Reliability Requirements

  43
  • 6.1 Test Conditions

    43
  • 6.2 Intel Reference Component Validation

    45
    • 6.2.1 Board Functional Test Sequence

      45
    • 6.2.2 Post-Test Pass Criteria

      45
    • 6.2.3 Recommended BIOS/Processor/Memory Test Procedures

      46
  • 6.3 Material and Recycling Requirements

    46
• A Component Suppliers

  47
  • A.1 Intel Enabled Supplier Information

    47
• B Mechanical Drawings

  51
• C Socket Mechanical Drawings

  79
• D Heatsink Load Metrology

  85
• E Embedded Thermal Solutions

  87
  • E.1 Performance Targets

    87
  • E.2 Thermal Design Guidelines

    88
  • E.3 Mechanical Drawings and Supplier Information

    92
• F Processor Installation Tool

  97