BenutzerhandbuchInhaltsverzeichnisPreface5Introduction5Document Layout5Conventions Used in this Guide6Recommended Reading7The Microchip Web Site7Customer Support7Document Revision History7Chapter 1. Product Overview91.1 Introduction91.2 MCP6031 Photodiode PICtail™ Plus Demo Board Kit Contents91.3 MCP6031 Photodiode PICtail™ Plus Demo Board Description10Chapter 2. Installation and Operation132.1 Introduction132.2 Required Tool132.3 MCP6031 Photodiode PICtail™ Plus Demo Board Set-up132.4 MCP6031 Photodiode PICtail™ Plus Demo Board Operation14Appendix A. Schematic and Layouts15A.1 Introduction15A.2 Board - Schematic16A.3 Board - Top Silk Layer17A.4 Board - Top Metal And Top Silk Layers17A.5 Board - Bottom Metal Layer18Appendix B. Bill of Materials (BOM)19Worldwide Sales and Service20Größe: 502 KBSeiten: 20Language: EnglishHandbuch öffnen
DatenbogenInhaltsverzeichnis1.0 Electrical Characteristics2FIGURE 1-1: Timing Diagram for the CS Pin on the MCP6033.41.1 Test Circuits5FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions.5FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions.52.0 Typical Performance Curves6FIGURE 2-1: Input Offset Voltage with VDD = 3.0V.6FIGURE 2-2: Input Offset Voltage Drift with VDD = 3.0V and TA £ +85 C.6FIGURE 2-3: Input Offset Voltage Drift with VDD = 3.0V and TA ³ +85 C.6FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V.6FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.8V.6FIGURE 2-6: Input Offset Voltage vs. Output Voltage.6FIGURE 2-7: Input Noise Voltage Density vs. Frequency.7FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage.7FIGURE 2-9: Common Mode Rejection Ratio, Power Supply Rejection Ratio vs. Frequency.7FIGURE 2-10: Common Mode Rejection Ratio, Power Supply Rejection Ratio vs. Ambient Temperature.7FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature.7FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage.7FIGURE 2-13: Quiescent Current vs Ambient Temperature.8FIGURE 2-14: Quiescent Current vs. Power Supply Voltage with VCM = VDD.8FIGURE 2-15: Quiescent Current vs. Power Supply Voltage with VCM = VSS.8FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency.8FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage.8FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom.8FIGURE 2-19: Channel-to-Channel Separation vs. Frequency ( MCP6032/4 only).9FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage.9FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.9FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.9FIGURE 2-23: Ouput Short Circuit Current vs. Power Supply Voltage.9FIGURE 2-24: Output Voltage Swing vs. Frequency.9FIGURE 2-25: Output Voltage Headroom vs. Output Current.10FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature.10FIGURE 2-27: Slew Rate vs. Ambient Temperature.10FIGURE 2-28: Small Signal Non-Inverting Pulse Response.10FIGURE 2-29: Small Signal Inverting Pulse Response.10FIGURE 2-30: Large Signal Non-Inverting Pulse Response.10FIGURE 2-31: Large Signal Inverting Pulse Response.11FIGURE 2-32: The MCP6031/2/3/4 family shows no phase reversal .11FIGURE 2-33: Chip Select (CS) to Amplifier Output Response Time (MCP6033 only).11FIGURE 2-34: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 5.5V.11FIGURE 2-35: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 3.0V.11FIGURE 2-36: Chip Select (CS) Hysteresis (MCP6033 only) with VDD = 1.8V.11FIGURE 2-37: Closed Loop Output Impedance vs. Frequency.12FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS).123.0 Pin Descriptions13TABLE 3-1: Pin Function Table133.1 Analog Outputs133.2 Analog Inputs133.3 Chip Select Digital Input133.4 Power Supply Pins134.0 Application Information144.1 Rail-to-Rail Input14FIGURE 4-1: Simplified Analog Input ESD Structures.14FIGURE 4-2: Protecting the Analog Inputs.144.2 Rail-to-Rail Output154.3 Output Loads and Battery Life154.4 Capacitive Loads15FIGURE 4-3: Output resistor, RISO stabilizes large capacitive loads.15FIGURE 4-4: Recommended RISO values for Capacitive Loads.154.5 MCP6033 Chip Select154.6 Supply Bypass164.7 Unused Op Amps16FIGURE 4-5: Unused Op Amps.164.8 PCB Surface Leakage16FIGURE 4-6: Example Guard Ring Layout for Inverting Gain.164.9 Application Circuits17FIGURE 4-7: High Side Battery Current Sensor.17FIGURE 4-8: Precision, Non-inverting Comparator.17FIGURE 4-9: Driving the MCP3421 using an R-C Snubber.175.0 Design Aids185.1 SPICE Macro Model185.2 FilterLab® Software185.3 Mindi™ Circuit Designer & Simulator185.4 MAPS (Microchip Advanced Part Selector)185.5 Analog Demonstration and Evaluation Boards185.6 Application Notes186.0 Packaging Information196.1 Package Marking Information19Größe: 637 KBSeiten: 34Language: EnglishHandbuch öffnen
