DatenbogenInhaltsverzeichnis1.0 Electrical Characteristics31.1 Absolute Maximum Ratings †31.2 Specifications3TABLE 1-1: DC Electrical Specifications3TABLE 1-2: AC Electrical Specifications4TABLE 1-3: Digital Electrical Specifications5TABLE 1-4: Temperature Specifications51.3 Timing Diagrams6FIGURE 1-1: Amplifier Start Up.6FIGURE 1-2: Offset Correction Settling Time.6FIGURE 1-3: Output Overdrive Recovery.6FIGURE 1-4: Chip Select (MCP6V03).61.4 Test Circuits6FIGURE 1-5: AC and DC Test Circuit for Most Non-Inverting Gain Conditions.6FIGURE 1-6: AC and DC Test Circuit for Most Inverting Gain Conditions.6FIGURE 1-7: Test Circuit for Dynamic Input Behavior.62.0 Typical Performance Curves72.1 DC Input Precision7FIGURE 2-1: Input Offset Voltage.7FIGURE 2-2: Input Offset Voltage Drift.7FIGURE 2-3: Input Offset Voltage Quadratic Temp Co.7FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMR_L.7FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMR_H.7FIGURE 2-6: Input Offset Voltage vs. Output Voltage.7FIGURE 2-7: Input Offset Voltage vs. Common Mode Voltage with VDD = 1.8V.8FIGURE 2-8: Input Offset Voltage vs. Common Mode Voltage with VDD = 5.5V.8FIGURE 2-9: CMRR.8FIGURE 2-10: PSRR.8FIGURE 2-11: DC Open-Loop Gain.8FIGURE 2-12: CMRR and PSRR vs. Ambient Temperature.8FIGURE 2-13: DC Open-Loop Gain vs. Ambient Temperature.9FIGURE 2-14: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +85 C.9FIGURE 2-15: Input Bias and Offset Currents vs. Common Mode Input Voltage with TA = +125 C.9FIGURE 2-16: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V.9FIGURE 2-17: Input Bias Current vs. Input Voltage (below VSS).92.2 Other DC Voltages and Currents10FIGURE 2-18: Input Common Mode Voltage Headroom (Range) vs. Ambient Temperature.10FIGURE 2-19: Output Voltage Headroom vs. Output Current.10FIGURE 2-20: Output Voltage Headroom vs. Ambient Temperature.10FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage.10FIGURE 2-22: Supply Current vs. Power Supply Voltage.10FIGURE 2-23: Power On Reset Trip Voltage.10FIGURE 2-24: Power On Reset Voltage vs. Ambient Temperature.112.3 Frequency Response12FIGURE 2-25: CMRR and PSRR vs. Frequency.12FIGURE 2-26: Open-Loop Gain vs. Frequency with VDD = 1.8V.12FIGURE 2-27: Open-Loop Gain vs. Frequency with VDD = 5.5V.12FIGURE 2-28: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature.12FIGURE 2-29: Gain Bandwidth Product and Phase Margin vs. Common Mode Input Voltage.12FIGURE 2-30: Gain Bandwidth Product and Phase Margin vs. Output Voltage.12FIGURE 2-31: Closed-Loop Output Impedance vs. Frequency with VDD = 1.8V.13FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V.13FIGURE 2-33: Channel-to-Channel Separation vs. Frequency.13FIGURE 2-34: Maximum Output Voltage Swing vs. Frequency.132.4 Input Noise and Distortion14FIGURE 2-35: Input Noise Voltage Density vs. Frequency.14FIGURE 2-36: Input Noise Voltage Density vs. Input Common Mode Voltage.14FIGURE 2-37: Inter-Modulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-7).14FIGURE 2-38: Inter-Modulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-7).14FIGURE 2-39: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD =1.8V.14FIGURE 2-40: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD =5.5V.142.5 Time Response15FIGURE 2-41: Input Offset Voltage vs. Time with Temperature Change.15FIGURE 2-42: Input Offset Voltage vs. Time at Power Up.15FIGURE 2-43: The MCP6V01/2/3 family shows no input phase reversal with overdrive.15FIGURE 2-44: Non-inverting Small Signal Step Response.15FIGURE 2-45: Non-inverting Large Signal Step Response.15FIGURE 2-46: Inverting Small Signal Step Response.15FIGURE 2-47: Inverting Large Signal Step Response.16FIGURE 2-48: Slew Rate vs. Ambient Temperature.16FIGURE 2-49: Output Overdrive Recovery vs. Time with G = -100 V/V.16FIGURE 2-50: Output Overdrive Recovery Time vs. Inverting Gain.162.6 Chip Select Response (MCP6V03 only)17FIGURE 2-51: Chip Select Current vs. Power Supply Voltage.17FIGURE 2-52: Power Supply Current vs. Chip Select Voltage with VDD = 1.8V.17FIGURE 2-53: Power Supply Current vs. Chip Select Voltage with VDD = 5.5V.17FIGURE 2-54: Chip Select Current vs. Chip Select Voltage.17FIGURE 2-55: Chip Select Voltage, Output Voltage vs. Time with VDD = 1.8V.17FIGURE 2-56: Chip Select Voltage, Output Voltage vs. Time with VDD = 5.5V.17FIGURE 2-57: Chip Select Relative Logic Thresholds vs. Ambient Temperature.18FIGURE 2-58: Chip Select Hysteresis.18FIGURE 2-59: Chip Select Turn On Time vs. Ambient Temperature.18FIGURE 2-60: Chip Select’s Pull-down Resistor (RPD) vs. Ambient Temperature.18FIGURE 2-61: Quiescent Current in Shutdown vs. Power Supply Voltage.183.0 Pin Descriptions19TABLE 3-1: Pin Function Table193.1 Analog Outputs193.2 Analog Inputs193.3 Power Supply Pins193.4 Chip Select (CS) Digital Input193.5 Exposed Thermal Pad (EP)194.0 Applications214.1 Overview of Auto-zeroing Operation21FIGURE 4-1: Simplified Auto-zeroed Op Amp Functional Diagram.21FIGURE 4-2: Normal Mode of Operation (f1); Equivalent Amplifier Diagram.22FIGURE 4-3: Auto-zeroing Mode of Operation (f2); Equivalent Diagram.224.2 Other Functional Blocks23FIGURE 4-4: Simplified Analog Input ESD Structures.23FIGURE 4-5: Protecting the Analog Inputs.234.3 Application Tips24FIGURE 4-6: Output Resistor, RISO, Stabilizes Capacitive Loads.24FIGURE 4-7: Recommended RISO values for Capacitive Loads.24FIGURE 4-8: Output Load Issue.25FIGURE 4-9: One Solution To Output Load Issue.25FIGURE 4-10: Additional Supply Filtering.25FIGURE 4-11: PCB Layout and Schematic for Single Non-inverting and Inverting Amplifiers.26FIGURE 4-12: PCB Layout and Schematic for Single Difference Amplifier.27FIGURE 4-13: PCB Layout and Schematic for Dual Non-inverting Amplifier.27FIGURE 4-14: PCB Layout for Individual Resistors.284.4 Typical Applications29FIGURE 4-15: Simple Design.29FIGURE 4-16: High Performance Design.29FIGURE 4-17: RTD Sensor.29FIGURE 4-18: Thermocouple Sensor; Simplified Circuit.30FIGURE 4-19: Thermocouple Sensor.30FIGURE 4-20: Offset Correction.30FIGURE 4-21: Precision Comparator.305.0 Design Aids315.1 SPICE Macro Model315.2 FilterLab® Software315.3 Mindi™ Circuit Designer & Simulator315.4 Microchip Advanced Part Selector (MAPS)315.5 Analog Demonstration and Evaluation Boards315.6 Application Notes316.0 Packaging Information336.1 Package Marking Information33Größe: 1000 KBSeiten: 44Language: EnglishHandbuch öffnen
DatenbogenInhaltsverzeichnisPreface5Introduction5Document Layout5Conventions Used in this Guide6Recommended Reading7The Microchip Web Site7Customer Support8Document Revision History8Chapter 1. Product Overview91.1 Introduction91.2 MCP6V01 Thermocouple Auto-Zeroed Reference Design Kit Contents91.3 MCP6V01 Thermocouple Auto-Zeroed Reference Design Description10Chapter 2. Installation and Operation152.1 Introduction152.2 Required Tool152.3 MCP6V01 Thermocouple Auto-Zeroed Reference Design Setup152.4 MCP6V01 Thermocouple Auto-Zeroed Reference Design Operation16Appendix A. Schematic and Layout21A.1 Introduction21A.2 Board - Schematic22A.3 Board - Top Silk Layer23A.4 Board - Top Metal Layer23A.5 Board - Metal Layer 224A.6 Board - Metal Layer 324A.7 Board - Bottom Silk Layer (Bottom View)25A.8 Board - Bottom Metal Layer25Appendix B. Bill Of Materials (BOM)27Worldwide Sales and Service30Größe: 655 KBSeiten: 30Language: EnglishHandbuch öffnen
