Benutzerhandbuch für Telit Communications S.p.A. HE910

Inhaltsverzeichnis

• INTRODUCTION

  6
• 1.1 SCOPE

  6
• 1.2 AUDIENCE

  6
• 1.3 CONTACT INFORMATION, SUPPORT

  6
• 1.4 DOCUMENT ORGANIZATION

  7
• 1.5 TEXT CONVENTIONS

  8
• 1.6 RELATED DOCUMENTS

  8
• 1.7 DOCUMENT HISTORY

  9
• OVERVIEW

  10
• HE910 MODULE CONNECTIONS

  11
• 3.1 PIN-OUT

  11
• 3.1.1 LGA Pads Layout (HE910 and HE910-GA)

  17
• 3.1.2 LGA Pads Layout (HE910-D)

  18
• HARDWARE COMMANDS

  19
• 4.1 TURNING ON THE HE910

  19
• 4.2 TURNING OFF THE HE910

  24
• 4.3 HE910 UNCONDITIONAL SHUTDOWN

  27
• POWER SUPPLY

  30
• 5.1 POWER SUPPLY REQUIREMENTS

  30
• 5.2 POWER CONSUMPTION

  31
• 5.3 GENERAL DESIGN RULES

  32
• 5.3.1 Electrical Design Guidelines

  32
• 5.3.2 Thermal Design Guidelines

  36
• 5.3.3 Power Supply PCB layout Guidelines

  37
• GSM/WCDMA ANTENNA

  38
• 6.1 GSM/WCDMA ANTENNA REQUIREMENTS

  38
• 6.2 GSM/WCDMA - PCB LINE GUIDELINES

  40
• 6.3 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES

  41
• 6.4 ANTENNA DIVERSITY REQUIREMENTS

  42
• 6.5 GPS ANTENNA REQUIREMENTS (HE910 AND HE910-GA)

  43
• 6.5.1 Combined GPS Antenna

  43
• 6.5.2 Linear and Patch GPS Antenna

  43
• 6.5.3 LNA and Front End Design Considerations

  43
• 6.5.4 GPS Antenna - PCB Line Guidelines

  44
• 6.5.5 GPS Antenna - Installation Guidelines

  45
• LOGIC LEVEL SPECIFICATIONS

  46
• 7.1 RESET SIGNAL

  47
• USB PORT

  48
• 8.1 USB 2.0 HS

  48
• SPI PORT

  49
• 9.1 SPI CONNECTIONS

  50
• SERIAL PORTS

  51
• 10.1 MODEM SERIAL PORT 1 (USIF0)

  52
• 10.2 MODEM SERIAL PORT 2 (USIF1)

  54
• 10.3 RS232 LEVEL TRANSLATION

  55
• AUDIO SECTION OVERVIEW

  57
• 11.1 ELECTRICAL CHARACTERISTICS

  57
• 11.1.1 CODEC Examples

  57
• GENERAL PURPOSE I/O

  58
• 12.1 GPIO LOGIC LEVELS

  59
• 12.2 USING A GPIO PAD AS INPUT

  60
• 12.3 USING A GPIO PAD AS OUTPUT

  60
• 12.4 INDICATION OF NETWORK SERVICE AVAILABILITY

  61
• 12.5 RTC BYPASS OUT

  62
• 12.6 EXTERNAL SIM HOLDER IMPLEMENTATION

  62
• 12.7 VAUX POWER OUTPUT

  62
• MOUNTING THE HE910 ON THE APPLICATION

  63
• 13.1 GENERAL

  63
• 13.2 MODULE FINISHING & DIMENSIONS

  63
• 13.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION

  64
• 13.4 STENCIL

  65
• 13.5 PCB PAD DESIGN

  65
• 13.6 RECOMMENDATIONS FOR PCB PAD DIMENSIONS (MM):

  66
• 13.7 SOLDER PASTE

  68
• 13.7.1 HE910 Solder reflow

  68
• PACKING SYSTEM

  70
• 14.1 MOISTURE SENSITIVITY

  72
• SAFETY RECOMMANDATIONS

  73
• CONFORMITY ASSESSMENT ISSUES

  75
• 16.1 1999/5/EC DIRECTIVE

  75
• 16.2 FCC/IC REGULATORY NOTICES

  79